Companies

eASIC

  • 2585 Augustine Drive Suite 100 Santa Clara
    CA 95054
    United States of America
  • +1 (408) 855-9200
  • http://www.easic.com
  • +1 (408) 855-9201

eASIC Articles

Displaying 1 - 17 of 17
Design
4th March 2013
Violin Memory Selects eASIC for Flash Memory Arrays

eASIC Corporation today announced that Violin Memory has selected eASIC’s Nextreme-2T NEW ASICs for implementing FLASH controllers for its latest 6000 Series enterprise-grade FLASH memory arrays.

Communications
2nd January 2013
LDPC NAND FLASH Read Channel For Enterprise Storage

eASIC Corporation and Proton Digital Systems announce the immediate availability of an LDPC NAND FLASH read channel for enterprise storage applications. The combination of IP from Proton Digital Systems and eASIC's NEW ASIC devices enables enterprise storage vendors to double the throughput performance at approximately half the power that can be achieved using state-of–the art FPGAs.

Renewables
4th May 2012
eASIC Enables 3X Increase in Energy Efficiency for Astrophysical Simulation Supercomputer

eASIC Corporation today announced that Tokyo Institute of Technology, in collaboration with Hitotsubashi University, has successfully demonstrated a 3X increase in energy efficiency for a green supercomputer used for performing astronomical simulations. By leveraging eASIC´s low power Nextreme-2 NEW ASIC devices, Tokyo Institute of Technology was able to achieve an energy efficiency ratio of 6.5 GFLOPS/Watt for its GRAPE-8 supercomputer.

Analysis
21st July 2011
Cisco Senior Vice President of Engineering Pankaj Patel Joins eASIC Board of Directors

eASIC Corporation, a provider of NEW ASIC devices, today announced that Pankaj Patel, Cisco Senior Vice President of Engineering has joined eASIC’s Board of Directors.

Analysis
21st July 2011
eASIC Announces easicopy ASIC

eASIC Corporation today announced the immediate availability of “easicopy”, an ASIC migration product that provides custom chip designers with a simple, low-risk migration path from eASIC Nextreme and Nextreme-2 NEW ASICs to cell-based ASIC devices.The addition of easicopy™ enables OEMs to continue to innovate and quickly ramp to volume production using eASIC Nextreme series devices, and now migrate to lower cost easicopy™ cell-based ASIC...

Analysis
16th December 2010
eASIC Introduces 45nm ASIC Value Shuttle Program

eASIC Corporation, a provider of NEW ASIC devices, today introduced a Value Shuttle™ program that lowers the entry cost for 45nm ASIC designs. The 45nm Value Shuttle™ enables designers to receive forty-five (45) eASIC Nextreme-2 NEW ASIC prototypes for only forty-five thousand dollars ($45K), a small fraction of the cost of competing ASIC solutions. Through reducing the cost, and hence development risk of ASIC design prototypes, the 45nm eASI...

Wireless Microsite
18th November 2010
eASIC and Radiocomp Deliver Low Power 6G CPRI v4.1 REC Solution

eASIC Corporation, a supplier of NEW ASICs and Radiocomp, a leading provider of modular RF systems and components for mobile and wireless infrastructure networks, today announced the immediate availability of a low power Common Public Radio Interface (CPRI) v4.1 solution for Radio Equipment Controller (REC) equipment. Using the low power transceivers on eASIC Nextreme-2T NEW ASICs, and the industry proven CPRI v4.1 REC IP core from Radiocomp, the...

Wireless
18th November 2010
eASIC and Radiocomp Deliver Low Power 6G CPRI v4.1 REC Solution

eASIC Corporation, a supplier of NEW ASICs and Radiocomp, a leading provider of modular RF systems and components for mobile and wireless infrastructure networks, today announced the immediate availability of a low power Common Public Radio Interface (CPRI) v4.1 solution for Radio Equipment Controller (REC) equipment. Using the low power transceivers on eASIC Nextreme-2T NEW ASICs, and the industry proven CPRI v4.1 REC IP core from Radiocomp, the...

Wireless Microsite
22nd October 2010
eASIC Enables Early Rollout of On-Ramp Wireless’ eNODE Solutions

eASIC Corporation today announced that On-Ramp Wireless, Inc. successfully rolled out its eNode Wireless modules six months ahead of schedule. Its fast-turnaround was facilitated by eASIC’s Nextreme NEW ASICs, which is a part of the eNODE baseband processing engine. eNODE wireless modules are used in wide area, low power and low data rate applications such as sensor monitoring, utility distribution automation, smart metering, and location track...

Wireless
22nd October 2010
eASIC Enables Early Rollout of On-Ramp Wireless’ eNODE Solutions

eASIC Corporation today announced that On-Ramp Wireless, Inc. successfully rolled out its eNode Wireless modules six months ahead of schedule. Its fast-turnaround was facilitated by eASIC’s Nextreme NEW ASICs, which is a part of the eNODE baseband processing engine. eNODE wireless modules are used in wide area, low power and low data rate applications such as sensor monitoring, utility distribution automation, smart metering, and location track...

Analysis
9th July 2010
eASIC Appoints Richard Heye as Chief Operating Officer

eASIC Corporation, a provider of NEW ASIC devices, today announced that Richard Heye has been appointed as Chief Operating Officer (COO). Heye brings 30 years of executive management, engineering and operations experience from within the semiconductor industry. Heye is chartered with spearheading eASIC’s engineering development of, as well as, growing operations to meet the rapid customer ramp. Heye will report directly to CEO, Ronnie Vasishta.

Design
20th May 2010
eASIC eTools 8.1 Design Suite Reduces Design Time by 40%

eASIC Corporation, a provider of NEW ASIC devices, today announced the immediate availability of its eTools 8.1 Design Suite for implementing 45nm Nextreme-2 designs. The eTools 8.1 tool suite delivers a robust ASIC grade design flow with the simplicity and ease of design that is normally associated with FPGA design tools. New features and enhancements in eTools 8.1 enable designers to reduce overall design time by up to 40% while increasing desi...

Design
20th May 2010
eASIC Nextreme Used for Hardware Validation of Microsoft RemoteFX Technology

eASIC Corporation today announced that it is working with Microsoft Corp. on using eASIC’s Nextreme NEW ASICs to create a hardware implementation of the Microsoft RemoteFXTM technology, which was announced two months ago. eASIC’s Nextreme product has been able to quickly validate the Microsoft RemoteFX technology in silicon and to attract a growing ecosystem of companies interested in developing eASIC-based solutions that accelerate the adopt...

Pending
25th January 2010
eASIC Slashes Power With Low Voltage Devices

eASIC Corporation, today announced the immediate availability of two new lower power device options for its eASIC Nextreme Family. The NX750LP and NX750 Nextreme devices are now available with operating voltage down to 1.0V thereby enabling designers to achieve up to 40% lower power consumption. The new 1.0V device options are optimized for applications that require low cost and low power such as smart meters, portable projectors, toys, and handh...

Design
22nd December 2009
Aptina And Easic Announce High Definition H.264 Reference Design

Aptina, a global provider of image sensor solutions and eASIC Corporation, today announced the immediate availability of a H.264 High Definition (HD) reference design that is capable of supporting up to 720p/30fps rates. The new HD reference design is aimed at enabling, and simplifying the development for a new class of low-cost HD applications and making low-cost HD solutions available for the masses. Applications include low-cost HD camcorders,...

Analysis
3rd December 2009
Mitsubishi Electric Selects eASIC For Display Wall Cubes

eASIC Corporation, a provider of NEW ASIC devices, today announced that Mitsubishi Electric Corporation (Kyoto Works), a leading global manufacturer of display wall systems, has selected eASIC’s Nextreme NEW ASICs for its Seventy Series Display Wall Cube Systems. Mitsubishi Electric used eASIC’s Nextreme devices to replace existing gate-arrays and improve the video processing system performance by 50%.

Design
3rd December 2009
New eTools 8.0 Software Simplifies 45nm ASIC Design

eASIC Corporation, a provider of NEW ASIC devices, today announced the immediate availability of its eTools 8.0 software suite for implementing 45nm Nextreme-2 designs. The eTools 8.0 tool suite delivers a robust ASIC grade design flow with the simplicity, ease of design, and a cost point that is normally associated with FPGA design tools. By focusing on ease-of-use, and low cost of entry, eASIC is now enabling designers to make a seamless transi...

First Previous Page 1 of 1 Next Last

Featured products

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier