ASMPT presents Vortex II

“High-resolution, ergonomic LED displays in modern cars ensure drivers have all important and safety-relevant information in view at all times,” said Jonathan Ku, Senior Director of Business Development, ASMPT. “This is where very small LEDs are used, which have to be assembled highly precisely and reliably – because customers from the automotive industry do not accept reworked products. It is exactly for such demanding tasks that we designed and developed Vortex II.”

The highly innovative die bonder can process Mini LEDs with a minimum size of 2 mil × 4 mil (50 µm × 100 µm), for example for direct view RGB LED displays with ultra-fine pitch. The machine uses a newly developed bond head with automatic delay-free XYθ correction. The precision of XY placement can achieve ± 10 µm @ 3σ, with a die rotation of ± 1° @ 3σ.

Process stability and high one-pass rates, even at maximum throughput, are guaranteed by an automatic correction function combined with ASMPT's patented bond head technology. The light-up yield is up to 99.999%. Due to fully automatic RGB wafer handling, this enables one-stop production and highly effective bin mixing and therefore uniform screen colours.

Vortex II is also ready for Industry 4.0 system architectures through automation with ASMPT's In-Line Linker System, which allows for efficient material handling, a specialised system that allows seamless integration of high-precision bonding systems into automated manufacturing processes.