ASMPT presents precision pick and place solution

In doing so, the company is underlining the growing importance of advanced packaging in generative AI and high-performance computing (HPC).

“As the AI industry continues to push the boundaries of computing power, the demand for HPC and AI chips have become a driving force behind innovations in advanced packaging technologies,” said Nelson Fan, Vice President of Business Development for Advanced Packaging at ASMPT. “With NUCLEUS XLplus, we are supplying exactly the right solution to enable the digital world.”

Fan-out packaging is becoming an essential technology for high volume semiconductor manufacturing in the AI era. With the NUCLEUS series from ASMPT, for 2.5D, fan-out and embedded packaging as well as for complete wafer-level and panel-level assembly, the company is addressing to this trend. The NUCLEUS series offers more performance and additional functions in a more cost-effective manner.

Furthermore, it offers exceptional accuracy in SiP bonding and flexibility in the fan-out process.

Key features of the NUCLEUS XLplus include:

• Support for a wide range of package configurations, from flip-chip to direct die attach for multi-die applications to meet the requirements of Heterogeneous Integration (HI) chipsets
• Processing of extra-large substrates up to 600 x 600 mm
• Optional high bond force and temperature capabilities for high-end applications
• High degree of automation with auto material load/unload and tooling change, meeting the SECS/GEM standard

“ASMPT is a pioneer in fan-out packaging technology,” concluded Fan. “We can build on our lead in development and technology. With our machines, manufacturers around the world will bring next-generation AI applications to the market.”