Production

Altus has strengthened its partnership portfolio by signing a new agreement to distribute and support equipment from Inertec, a supplier of innovative soldering technologies.

igus has developed an ‘e-skin flat’ single pod - designed specifically to guide cables in compact and particle-free cleanrooms. To ensure quick and easy installation customers can use the e-skin flat to select and combine chambers and then insert the cables in seconds. There is also the option of a new support chain, which strengthens the e-skin flat.

More than a dozen of Advantest’s latest test solutions and products will be on show at the first-ever virtual SEMICON Japan (December 14-17) where once again the company will be a gold-level sponsor.

Altus has added to its portfolio of production equipment by agreeing a deal to distribute LPKF’s laser-based solutions for the technology industry.

Working with its partner PDF Solutions, Advantest has introduced two new innovative cloud-based software solutions: the Advantest V93000 Dynamic Parametric Test (DPT) system powered by PDF Exensio DPT, and an edge high performance compute (HPC) system.

Stratasys has signed an agreement to acquire 3D printing start-up Origin in a transaction for total consideration of up to $100 million, including cash and stock, hoping to bring new additive manufacturing platform to polymer production. The merger enables Stratasys to expand its leadership through innovation in the fast-growing mass production parts segment with a next-generation photopolymer platform. Subject to various approvals and other clos...

Improving your solder joint formation is a skill that takes time, understanding and maybe a few errors along the way. In this month’s edition of Hakko Tech Tips, the company has explored solder joints in more detail. Topics for discussion will include using too much flux, how to test solder joints and reworking existing soldered joints.

Smiths Interconnect has expanded its Volta product line to incorporate Volta180 probe heads, to support the Wafer Level Packages and Known Good Dies test businesses.

Now that now things are tentatively back up and running, businesses are looking for ways to use their people and their equipment to be as competitive as possible in challenging markets. Here Kevin Cook, Technical Manager at adhesives specialist Intertronics, has shared insight on how manufacturers can improve productivity by updating their adhesives process.

Advantest and STMicroelectronics have jointly developed an advanced, fully-automated final-test cell system that improves overall equipment efficiency and quality in semiconductor test and packaging operations.