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In this month’s issue of Hakko Tech Tips, Hakko is going to explore a number of aspects of soldering, largely covering the pain point of fixing a bad solder joint, we have all been there and hopefully our tips can help. To mix it up a little, we will also look at metals that can’t be soldered and examine the differences between soldering and sweating, as well as welding and soldering.

Machine learning specialist, Intellegens, and engineering simulation specialist, Ansys, have announced a collaboration to integrate machine learning methods into Additive Manufacturing (AM) workflows, accelerating the development of reliable and repeatable AM processes.

PCB is an important part of any device that you can think of nowadays. So you should choose it properly, and the manufacturing and assembly should be done properly. Thus, there should be no mistakes while choosing a PCB.

The new i7090 massively parallel board test system from Keysight Technologies is a new category of automated test equipment designed to perform tests in parallel, on multiple printed circuit board assemblies (PCBA).

Cyanoacrylates (CAs) are easy to use, single-part adhesives that cure quickly at room temperature, offer good throughput and are suitable for bonding a range of substrates. Here Peter Swanson, Managing Director of adhesives specialist Intertronics, has shared his tips on how to manage and prevent blooming in your CA process.

A typical question put to a manufacturer of reflow soldering systems like Rehm Thermal Systems is often: ‘What is the benefit of a nitrogen atmosphere?’ In the following Rehm has explored this question in relation to typical soldering defect scenarios, including those involving solder balls, beading, voiding, whiskers, graping, head-in-pillow, wetting defects and tombstones. 

BARCUDA VP230 is a turnkey solution from GÖPEL electronic to flexibly test, program and put assemblies into functional mode.

In this month’s issue of Hakko Tech Tips, the company has focused on an area that can cause a lot of issues. The simple reason being that we want to help iron those out for you this year. Correctly soldered joints on a PCB are essential to safely conduct currents and function efficiently inside a device.

Silicon was first discovered in 1787, but it wasn’t until the 1950s that it became widely used in industry. In contrast, the Graphene Flagship has been working to bring graphene to the market in just ten years. Determining accepted technical standards for graphene will play a large part in meeting that deadline. In this article, Thurid Gspann, Chair of the Graphene Flagship Standardisation Committee (GFSC), has explained why standardisation...

Semiconductor test equipment supplier Advantest says that its DC Scale XPS256 Device Power Supply (DPS) card, developed for use with the V93000 EXA Scale SoC test system, is now ramping to production-volume test at leading makers of communications processors.