OSM computing modules cut connector, cuts costs

The scalable standard module family integrates i.MX 93 applications processors from NXP Semiconductors.

The modules are housed in a pre-tinned LGA package can be soldered directly to the PCB and are suited for fully automated soldering, assembly and testing processing.

By reducing the number of production steps and eliminating the cost of a connector, significant cost savings can be achieved compared to existing module form factors. The solder-on modules are optimised for large quantities.

The module family is mainly used in industrial low-power applications that are cost-sensitive or need small dimensions.

Typical examples include optimised IoT systems such as small gateways, industrial control systems and home automation solutions. The OSM boards are particularly rugged and resistant to shock and vibration and are specified for the extended temperature range from -40 to +85 °C.

Tim Jensen, Director of Product Innovation, Avnet Embedded, said: ”The compact, scalable OSM embedded computing modules are optimized for large quantities and open numerous innovative application fields.”

Avnet Embedded develops all embedded modules in its company-owned design centres. The products are manufactured in large quantities in highly automated production facilities in Germany. Avnet Embedded’s first OSM products MSC OSM-MF-IMX8MINI and MSC OSM-MF-IMX8NANO are based on NXP Semiconductors’ i.MX 8M Mini and i.MX 8M Nano SOCs with Arm Cortex-A53 processors.

Technical specifications

Avnet Embedded’s compact MSC OSM-SF-IMX93 OSM module family is highly scalable and equipped with i.MX 93 applicationsprocessors manufactured by NXP Semiconductors. The processors integrate single or dual Arm Cortex-A55 cores up to 1.7GHz bringing performance and energy efficiency to Linux-based edge applications.

The Arm Ethos-U65 microNPU enables developers to create capable, cost-effective and energy-efficient machine learning (ML) applications. The i.MX 93 processors deliver advanced security with integrated EdgeLock secure enclave and an efficient 2D graphics processing unit (GPU).

The modules provide fast and low power LPDDR4memory technology with inline ECC support, combined with up to 256GB eMMC Flash memory.

Various interfaces for embedded applications such as Dual Gigabit Ethernet (RGMII), USB 2.0, 2x CAN-FD, MIPI-DSI and MIPI CSI-2 (2-lane) for connecting a camera are available. The typical design power ranges from 2 to 4W.

For evaluation and design-in of the new MSC OSM-SF-IMX93 modules, Avnet Embedded provides a developmentplatform, a starter kit and comprehensive design services. A Yocto based Linux Board Support Package is available (Android support on request).