Design engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, more specifically the STM32F7 and STM32N6 series.

Avnet ASIC, a business division of Avnet Silica, an Avnet company, has announced that it has been chosen by Hailo, the chip maker of Edge artificial intelligence (AI) processors, as its silicon channel partner for future chips on its product roadmap.

Tria Technologies is launching five new product families powered by Qualcomm Dragonwing and Snapdragon platforms at its embedded world debut. Tria is a module vendor with one of the largest SMARC portfolios in the market.

This season contains abundant prognostications of all sorts attempting to forecast trends for the year ahead. Rather than peering into a crystal ball filled with guesses, Jim Beneke, Vice President, Tria (An Avnet company) has taken a closer look at the company’s own analytics, compared them with projections from outside analysts, and can provide some solid trends for electronics designers to consider in the calendar year ahead.

Paige West speaks with Christian Engels, Product Marketing Manager, Tria Technologies about Avnet’s new Tria brand.

Avnet ASIC has announced that it has launched its new low-power design services for TSMC's 4nm and below process technologies.

Avnet has announced the launch of a new product brand Tria and a corresponding business called Tria Technologies to consolidate its compute design and manufacturing.

The new K24 I/O development kit from Avnet is the latest offering for the AMD Kria System-on-Module (SOM) portfolio.

Avnet’s exhibit plans for the 2024 Embedded Vision Summit include new development kits supporting AI applications.

Avnet has rolled out a new development kit enabling design engineers to create a spectrum of simple to sophisticated Field Programmable Gate Array (FPGA) applications.

Citing economic softness and lower demand Avnet reported sales down 13.2 per cent to $5.7 billion from $6.5 billion the previous year.

Avnet is collaborating with STMicroelectronics at embedded world 2024 to showcase cloud connected solutions featuring Avnet's IoTConnect and ST's microcontrollers.

Avnet will showcase IoTConnect demonstrations across a variety of exhibits at this year’s embedded world conference in Nuremberg, Germany from April 9-11.

The new VE2302 System-On-Module from Avnet is the first AMD Versal* AI Edge SOM to be added to Avnet’s popular line of SOMs based on the Adaptive SoC family of AMD products.

EPC Space has agreed a global distribution pact with Avnet covering EPC Space’s line of radiation hardened (Rad Hard) GaN power devices qualified for satellite and high-reliability applications.

The new MaaXBoard OSM93 development kit from Avnet is the latest single-board computer (SBC) to be added to the popular MaaxBoard series of SBCs based on the i.MX 8 and i.MX 9 series of NXP Semiconductors* application processors.

indie Semiconductor and Avnet have executed a distribution agreement to accelerate global availability of indie’s innovative semiconductor product portfolio, leveraging Avnet’s extensive market reach, support, and fulfillment capabilities.

Avnet has released the Avnet RFSoC Explorer Toolbox Version 3.0, which now includes support for over-the-air antenna to bits prototyping with the 5G mmWave Phased Array Antenna Module (PAAM) Development platform.

Avnet has unveiled the MSC C10M-ALN module, a COM Express Type 10 module integrating the Intel Atom processor x7000E Series, including the Intel Core i3 processor and Intel Processor N Series (codenamed Alderlake N).

Avnet has released the M.2 HSIO, the latest Add-On Module for the ZUBoard 1CG.