Automotive
Broadcom Delivers Ethernet PHY for Automotive Networks
Broadcom Corporation today announced a new physical layer transceiver (PHY) for automotive networks. The Broadcom BroadR-Reach BCM89810 PHY provides the industry's lowest cost cabling solution for 100 Mbps Ethernet connectivity over unshielded single twisted pair wiring. Engineered to meet the stringent in-vehicle requirements of the automotive industry, the BCM89810 is optimized for multiple in-car applications and supports a variety of connecti...
Automotive varistor series from AVX delivers the lowest specified leakage current available
AVX Corporation has developed an advanced varistor designed for general ESD protection use in automotive circuits, including CMOS, bi-polar, and SiGe based systems. The AEC Q200-qualified Automotive StaticGuard Series varistor delivers low capacitance and the lowest specified leakage current available in the industry, ideal for high-speed signal lines. The varistor series provides bi-directional transient voltage protection in the on-state and e...
Fuel Quality Sensor helps to protect the Engine and the Environment
The global mega trend to reduce the dependency on fossil fuels to bring down transportation related CO2 emissions has pushed the use of an increasing number of alternative fuels. These fuels include bio diesels produced from various ester origins, and fuels with ethanol content (E10+). As the regional strategies to overcome foreign oil dependency vary, modern world cars will need to be prepared for diverse fuel qualities. Continental, the interna...
Atmel Launches Secure, Ultra-low Power AES-128 AVR MCU with Immobilizer for Car Key Fob Applications
Atmel Corporation today announced availability of a new ultra-low power AVR microcontroller (MCU) with AES-128 immobilizer protocol stack. The Atmel ATA5790N includes LF immobilizer functionality and a 3D LF receiver in a single 5mm x 7mm package. When combined with the companion device ATA5830 RF transmitter, the Atmel ATA5790N is ideal for high-volume uni- and bi-directional car key fobs for passive entry and passive start systems.
Greenliant Now Shipping SATA NANDrive, Increasing Adoption of Embedded Solid State Drives
Greenliant Systems has started volume production of its SATA interface NANDrive solid state drives (SSDs). The GLS85LS product family has the same pin-out across all capacities—2 GB, 4 GB, 8 GB, 16 GB, 32 GB and higher in the future—which simplifies system-level board design.
VPG Releases HTH Foil Resistors with Operating Temperature up to +240°C, TCR of ±1 ppm/°C, and Load-Life Stability to ±0.05% at +220°C
Vishay Precision Group, Inc today announced that its Vishay Foil Resistors division (VFR) has introduced a new series of ultra-high-precision Bulk Metal Z1-Foil hybrid, surface-mount chip resistors connected using gold wire bonding. The HTH series is designed for high-temperature applications to +240°C and offers improved heat dissipation, providing nearly a 100 °C extension in operating temperature range over precision thin film chip resistors...
SMSC Introduces Industry's First 7-Port USB 3.0 Hybrid Hub Controller Family
SMSC announced the USB553x, a family of USB 3.0 hub controllers consisting of 7-port and a 4-port offerings. These new SuperSpeed USB hubs deliver the industry's smallest footprint, hybrid speed configuration with an optimized BOM cost for designers of the emerging USB 3.0 ecosystem. The devices also feature programmable flexibility for configuration of performance enhancing features, and the ability to support 2-layer PCB designs. The USB553X fa...
SMSC Introduces Small Footprint, USB 2.0 Switches with Multiplexing, Port Protection & Battery Charger Detection
SMSC announced two products offering the latest advancements in Hi-Speed USB 2.0 connectivity, the USB3750 and USB3740. These newest additions to SMSC's family of industry-leading Hi-Speed USB connectivity products are designed for portable devices and offer a compelling USB solution for mobile battery powered applications.
Atmel Launches Industry's First LIN Transceivers in DFN Packages to Enable Smaller Footprint
Atmel Corporation today announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. Compared to standard SO8 packages at 5mm x 6.5mm, the DFN14 package for the ATA6670 measures at 3mm x 4.5mm, while the DFN8 package for the ATA6663 measures at 3mm x 3mm, saving about 75 percent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive bod...
Vishay Intertechnology’s VJ Automotive Series Surface-Mount MLCCs Available With Polymer Terminations to Reduce Failures Related to Board-Flex Cracking
In a move to decrease capacitor failures related to board-flex cracking, Vishay Intertechnology today introduced its new VJ automotive series of surface-mount multilayer ceramic chip capacitors (MLCCs), available with optional polymer terminations designed to withstand higher levels of bending stress. The devices are offered with C0G (NP0) and X5R/X7R/X8R dielectrics, each with a wide range of case sizes, voltage ratings, and capacitance values.