Industries

STMicroelectronics has unveiled its second-generation Near Field Communications (NFC) controller. ST says the new IC, in combination with its wide Secure Element portfolio, will speed up the arrival of a new world of secure contactless apps and services accessible through next-generation smartphones.

Avec le contrôleur synchrone de MOSFET ZXGD3105N8 de Diodes Incorporated, les concepteurs d’alimentations flyback remplaceront les redresseurs Schottky de médiocre efficacité par un dispositif commandant le MOSFET comme une diode idéale ; ils pourront obtenir, dans les boîtiers décodeurs par exemple, une consommation de veille de moins de 100 mW et un rendement à pleine charge supérieur à 87%.

NXP Semiconductors today announced the availability of a new family of FlexRay transceivers that supports the automotive industry move towards a 48V board net in future vehicles. The new 48V FlexRay products complement the existing portfolio of 48V CAN transceivers. Last year, at an international automotive electronics congress in Ludwigsburg, Germany, the top five German carmakers BMW, Audi, Daimler, Porsche, and Volkswagen had jointly announced...

Responding to its customers’ needs for applications with high-temperature requirements, X-FAB Silicon Foundries today announced XH018 HT – a new module that adds high-temperature capability to its XH018 technology family. It offers the industry’s first and only 0.18 micrometer platform with high temperature (HT), high voltage (HV) and non-volatile memory (NVM) capability. X-FAB also added 13 new primitive devices with this extension, includ...

Maxim Integrated Products Inc introduces the MAX2769B and MAX2670, next-generation high performance solutions specifically designed to address Global Navigation Satellite System (GNSS) applications. These flexible receiver solutions are capable of operating over the navigation standards, GPS, GLONASS, Galileo, and Compass and have completed PPAP and AEC-Q100 approval.

Showcasing for the very first time on the Alpha Micro (stand 19a) located in the new Wireless zone at NEW 2012, will be a wide range of ultra low power Wi-Fi modules from GainSpan, 2G and 3G small form factor modems from u-blox, energy harvesting devices from EnOcean and the new xPico chip-sized networking module for Ethernet connectivity from Lantronix.

Yokogawa Electric Corporation has developed three new field wireless system devices and has enhanced existing wireless pressure and temperature transmitters, all of which are compliant with the ISA100.11a wireless standard. The first of these products are scheduled to be released in March 2012.

RFMD’s new RF5540 is designed specifically for high-performance WiFi applications in the 5GHz ISM band. This module integrates the LNA with bypass mode and an SPDT switch in a front end solution. The integrated 50Ω input and output match minimizes the number of external components required – optimizing the size and cost of the solution. The RF5540 is packaged in a 2mm x 2mm x 0.5mm, 12-pin QFN.

The Toolkit comprises Lime's configurable transceiver board linked to an Altera FPGA design kit via a purpose-built high speed mezzanine connection (HSMC) interface board. The combination of Lime and Altera boards enables almost any wireless application to be easily created, from consumer and enterprise broadband equipment through to bespoke white space, military and GNU Radio applications.

Texas Instruments Incorporated today introduced the industry’s most highly integrated automotive-qualified, 16-bit delta-sigma analog-to-digital converter (ADC). The ADS1115-Q1 includes a reference, programmable gain amplifier (PGA), mux and oscillator in a small package and supports up to 860 samples per second (SPS). For automotive applications such as battery monitoring systems in HEV/EV vehicles, fuel or oil pressure sensing, the ADS111...