Industries
Small Low Power Complete WiFi Module
The RN-171 from Roving Networks is an low cost, comprehensive networking solution that includes a 2.4 GHz radio, baseband processor and a host of networking application features. Measuring 26 x 18 x 3.1mm the RN-171 is 34% smaller than its predecessor, the RN-131. Its small size and low power is perfect for embedded WiFi devices such as remote sensors and asset tracking devices.
RADWIN Launches High Capacity Point-to-MultiPoint Solution for Licensed 3.x & 2.5 GHz Bands
RADWIN have announced the launch of its RADWIN 5000 High capacity Point-to-MultiPoint (HPMP) solution for the licensed 3.x GHz and 2.5 GHz bands. RADWIN 5000 HPMP delivers up to 100 Mbps aggregate net throughput per sector in these licensed bands, as well as dedicated bandwidth with guaranteed Service Level Agreement (SLA) and highest spectrum efficiency. RADWIN 5000 HPMP allows operators who own WiMAX licenses to leverage these bands in order to...
Marvell announces the industry's first single-chip 'World Modem' for global connectivity
Marvell has announced its latest breakthrough technology for global mobile communications, the Marvell® PXA1801 single-chip LTE world modem. The PXA1801 single-chip LTE world modem combines Marvell’s leading communications and silicon expertise to enable the design of a wide array of high-performance, low-power Internet-connected devices including: smartphones, tablets, laptops, automotive, set-top-boxes and TVs.
Ruckus Simplifies the Authentication, Security and Troubleshooting of Wi-Fi-Enabled Smart Mobile Devices with FlexConnect
Ruckus Wireless™ today announced FlexConnect™, a unique collection of patented technologies that streamline the provisioning and security of a wide range of smart mobile devices to better enable corporations to deal with the barrage of new Wi-Fi-enabled devices hitting enterprise networks.
Laird Technologies Releases New Bluetooth® BTM 440/441/442/443 Wireless Data Modules
Laird Technologies, Inc. has announced the release of its new BTM 440/441/442/443 Bluetooth® Enhanced Data modules. Meeting full FCC, CE and Bluetooth SIG approvals, the new modules comply with the Bluetooth 2.1 standard. They are also available in either AT command or Multipoint API modes by default. The enhanced Multipoint mode supports up to seven simultaneously connected slave devices; making the modules an ideal embedded solution for more t...
Freescale rolls out first products in QorIQ Qonverge wireless base station processor portfolio
Freescale Semiconductor is now sampling the first base station-on-chip products built on its innovative QorIQ Qonverge multimode platform. The new QorIQ Qonverge PSC9132 system-on-chip (SoC) for picocell and PSC9130/31 SoCs for femtocell base stations share a single, scalable architecture that simultaneously supports multiple air interfaces, providing operators and OEMs future-proof, highly integrated heterogeneous solutions that help minimize po...
STMicroelectronics Enables New Consumer Conveniences with Combination of Innovative Wireless Memory and NFC Technology
STMicroelectronics announced the strengthening of its position in the Near-Field Communication (NFC) market by extending user’s ability to read, write and transfer information on ST’s dual-interface Memory to a broad range of industrial and consumer applications.
Pulse Electronics Introduces LTE Capability in Navigation Antennas
Pulse Electronics Corporation, a leading provider of electronic components, introduces its new vehicular mount antenna for long term evolution, 3G, 4G, WLAN, and GPS applications. The GPSDM700/2500FFS offers the best gain on the market over multiple frequency bands. Wider frequency bands (698-960/1710-2170/2300-2700/1575 MHz) are covered in one small, compact 3.5 (88.3mm) tall, 4.16 (105.7mm) diameter at base antenna. This antenna is ideal for vo...
Atmel Launches Industry's First LIN Transceivers in DFN Packages to Enable Smaller Footprint
Atmel Corporation has announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. Compared to standard SO8 packages at 5mm x 6.5mm, the DFN14 package for the ATA6670 measures at 3mm x 4.5mm, while the DFN8 package for the ATA6663 measures at 3mm x 3mm, saving about 75 percent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive body ...
AVX Develops Smallest Dual Element Multilayer Varistor with Exceptionally High ESD Value
AVX corporation has expanded its rugged automotive portfolio to include a miniature, dual element AC multilayer varistor designed for use in automotive low power AC circuits. Designated the MAV Series, the AEC Q200-qualified MLV not only has the ability to clamp large amounts of transients in a bi-directional manner, but also provides and excellent EMI/RFI attenuation in the off-state, making it unsurpassed in efficiency as well as safety.