Special topics at SMT Hybrid Packaging

19th March 2014

Nat Bowers

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The SMT Hybrid Packaging International Exhibition and Conference for System Integration in Micro Electronics, Nuremberg, 6-8 May 2014, will feature several special topics presented with their own exhibition areas. The production line of the Fraunhofer IZM in Hall 6 will be dedicated to "Industry 4.0 - With new Technologies towards lot size 1".

Another focus in Hall 6 is the joint stand “Optics Meets Electronics” which is conceptionally supervised by Frauenhofer IZM Berlin. This individual marketplace highlights the significance of optical technologies in the electronics fields, as well as the Photonic Systems Integration.

At the forum in hall 7, visitors have the opportunity to learn about the current state of MID_Technology and new series applications from all relevant technology sectors. The association 3D_MID will present herewith its expertise.

At the joint stand “EMS Intersection”, companies in contract manufacturing will show their products and services. Rounding out the holistic approach is the integrated forum where visitors can gain expert knowledge on Electronics Manufacturing Services.

Parallel to the exhibition, the 13th Electronic Circuits World Convention (ECWC13) will take place from 7- 9 May 2014. On three conference days, in 26 sessions with 123 presentations, ECWC13 examines new processes, current technologies and changing market dynamics of the printed circuit board industry. The organiser is the European Institute of Printed Circuits as a member of the World Electronic Circuits Council. Its members have been holding the ECWC for more than 35 years, every three years alternately in Asia, Europe and the USA. The conference will start on Wednesday, 7 May 2014.

On the day before the start of the conference, the proven SMT tutorials will take place. Beginners and experts have the chance to develop and expand their knowledge in the whole field of electronic component manufacturing in practice-oriented tutorials.