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SMT Hybrid Packaging 2016: Call for Tutorials open

14th August 2015
Jordan Mulcare
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SMT Hybrid Packaging's Call for Tutorials invites experts from industry and academia to submit abstracts relating to system integration in microelectronics. Deadline for any submissions is 5th October 2015.

SMT Hybrid Packaging is the international meeting place for products and services along the entire value chain of electronics manufacturing, from research via materials and components to manufacturing and test equipment. In two half-day sessions, the conference analyses cutting-edge topics of modern system integration and its applications. The tutorials provide basic and technical knowledge with a practical focus.

Abstracts can be submitted for various topic areas defined by the conference committee, chaired by Prof. Dr. Klaus-Dieter Lang of Fraunhofer Institute for Reliability and Microintegration (IZM):

  1. Interconnection technology
  2. Soldering
  3. Adhesive bonding
  4. DIE and wire bonding, flip chip
  5. Application techniques
  6. Sintering
  7. Crimping
  8. Reliability and quality of printed circuit boards
  9. Process optimization and traceability, competitiveness
  10. New materials, materials development, material efficiency
  11. Assembly of electronic components
  12. Packaging and system integration
  13. Power electronics and high temperature PCB
  14. 3-D integration technologies
  15. Design and development tools
  16. Printed electronics
  17. Manufacturing logistics, equipment optimization and Overall Equipment Effectiveness (OEE)
  18. Power LED systems and photonic boards
  19. Environment, energy efficiency, disposal
  20. Flex and rigid-flex PCB
  21. Panel level packaging
  22. Component standardization

SMT Hybrid Packaging takes place from 26th to 28th April 2016, in Nuremberg.

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