Samtec announces plans for DesignCon 2024

Booth demos take centre stage

Samtec is set to reveal a dynamic array of high-speed interconnect products at Booth #939 during DesignCon. Demonstrating versatility across front panel, mid-board, and backplane applications, Samtec's showcase will feature collaborations with industry leaders including Alphawave Semi, Cadence, Keysight, Microchip, Multilane, Rambus, Rohde & Schwarz, and Synopsys, with active 112 Gbps and 224 Gbps demonstrations.

Aligned with the evolving landscape of high-speed connectivity, Samtec's DesignCon booth will host 224 Gbps demos, spotlighting innovative products. Starting at the front panel, offerings include Flyover SFP, QSFP, OSFP, and Samtec’s proprietary NovaRay IO.

These products extend to mid-board families: Si-Fly High Density, Si-Fly Low Profile, NovaRay, and Accelerate High Density (HD). Moving from mid-board to the backplane, Samtec introduces Si-Fly Back Plane and NovaRay Backplane alongside existing families ExaMAX and Xcede HD.

Samtec is thrilled to showcase optical mid-board options, including FireFly, FireHawk, and the newly introduced Halo. These products will connect with partner platforms through Bulls Eye, Samtec's precision RF test point system, with a new Bulls Eye 90 GHz version. Demonstrations will not only activate the products electrically but also mechanically, showcasing the stability and reliability of the systems and components.

Samtec products will also be part of active 112 Gbps and 224 Gbps demonstrations in partner booths – Keysight, Cadence, and Rohde & Schwarz.

Samtec experts to present at DesignCon 2024

Samtec engineers are participating in and/or authoring papers for multiple sessions, including two panels, a tutorial, six technical sessions, and two sponsored sessions.