Nordson DAGE to discuss X-ray inspection at SMTAI

Both presentations will be held during Session PRC1, “Radiography Techniques for Inspection of Advanced Electronic Packages,” on September 30th, 2-3:30 p.m. in Room 51 at the Donald Stephens Convention Center in Illinois, USA.

'X-ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding' was co-authored with John Tingay, Technical Director, X-ray Products, Nordson DAGE. In this study, the Large Board CT technique was used to correlate the bond strength as measured by the shear test to the size and location of the voiding as determined by the Large Board CT. A very large sample of BGA devices mounted on PCBs is utilised to achieve good statistical significance. Various levels of automation for both the Bondtester and X-ray measurements are employed in order to speed up the process.

'Optimizing X-ray Inspection with Package on Package' was co-authored with Zhen (Jane) Feng, Ph.D., David Geiger, Weifeng Liu, Ph.D., Hung Le, Tho Vu, Anwar Mohammed and Murad Kurwa, Flextronics International. This study aimed to: understand current AXI capabilities detecting PoP defects; explore ways to optimise the AXI algorithms in order to improve defect detection; and try to develop a process for AXI algorithm optimisation.