Nordson DAGE exhibit X-ray and bondtesting equipment

The Nordson DAGE XD7600NT Diamond X-ray inspection system provides 0.1µm feature recognition and up to 10W of power, together with the 2MP XiDAT3 digital image detector, thus making it suitable for the highest performance and highest magnification imaging tasks. The system will be displayed with the Nordson DAGE µCT inspection option that provides Computerised Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson DAGE X-ray inspection systems.

The 4000 Optima bondtester delivers unrivalled performance, to meet and exceed test standards, combined with ultimate speed and flexibility. The combination of patented technology and superior ergonomics with intelligent and intuitive software makes the 4000 Optima the number one production bond tester; providing repeatable and reproducible results.

The 4000Plus bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.

In Booth 1413, Nordson DAGE representatives will highlight the XM8000 Wafer X-ray Metrology Platform that provides fast automatic X-ray measurement of TSVs, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions. This platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features.