Indium to showcase semiconductor innovations at IMAPS

Indium Corporation’s proven SiPaste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance.

Indium Corporation’s SiPaste C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporation’s newest jetting solder paste, PicoShot NC-6M, is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems.

Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimised for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6 nL/dot. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.