Indium to introduce Heat-Spring pattern

Indium will showcase the following selections from its array of high-performance metal TIM solutions:

Heat-Spring HSx

• Newest pattern designed for large area dies with warpage >200 microns
• Effective thermal conductivity of 16W/m-K at only 20psi with pure indium
• Designed for test heads where clamping forces are limited to <30psi
• Thickness ranging from 300 micron up to 1mm
• Available with or without a diffusion barrier to prevent staining of the die

Heat-Spring HSD

• The original and best standard option for interfaces with flat, smooth, and parallel surfaces
• Designed for interfaces with tight surface control >30psi

Heat-Spring High Profile Preforms

• Patterned to optimise contact with non-planar surfaces delivering 86W/mK
• Ideal for assemblies with an extruded, unfinished heat-sink
• Recommended for immersion cooling and burn-in applications
• Provides uniform contact between the burn-in head and the DUT
• Provides more uniform thermal conductivity

Heat-Spring HSK

• Recommended specifically for burn-in applications where multiple insertions are required
• Provides uniform contact with low resistance for high-density heat loads
• Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
• No staining or cracking