Indium expert to present at HiTEN conference

The presentation, ‘Electrification & Power Modules – Innovative High-Reliability Solder Materials’, will focus on interconnect solder materials designed to meet the more stringent requirements brought on by increased electrification in automotive and other power electronics applications.

“Mission profiles have become harsher with higher service temperatures, increased cycles, and lower Rth,” said Vijay. “Power module construction is also evolving. This means that the interconnect solder materials for substrate-attach, clip-attach, and module-attach will need to be designed for the newer requirements.”    

Vijay heads the applications engineering team for customers in Europe, Africa, and the Middle East. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics, focusing on using different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials. He has more than 20 years of experience in electronics assembly and a master’s degree in industrial engineering with a specialisation in electronics packaging and manufacturing from the State University of New York, Binghamton. He is a Certified SMT Process Engineer and earned his Six Sigma Green Belt certification from Dartmouth College’s Thayer School of Engineering. Vijay is active in several industry organisations, including IMAPS and SMTA, and has presented at several industry forums and conferences nationally and internationally.