Indium Corporation to showcase preforms at SPIE Photonics West

This event is a leading global forum for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.

As a leading solder supplier for laser and optical applications, Indium Corporation offers gold-based alloys as an optimal choice for applications requiring high-melting die-attach solder. These alloys not only meet the stringent thermal and electrical requirements for high-reliability applications but also provide the most robust corrosion- and oxidation-resistant solder joints.

Semiconductor laser die-attach applications demand the highest quality and ultra-precise solder preforms to ensure accuracy and repeatability during assembly, guaranteeing a highly reliable end product. Indium Corporation's gold-based PDA preforms represent the new gold standard in quality, delivering unmatched performance in critical, high-reliability die-attach applications. Key features include highly accurate thickness control, precise edge quality, optimised cleanliness, default waffle pack packaging, and availability for gold-based alloys.

The company's AuLTRA 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to enhance intermetallic reliability in applications using thicker gold-plated dies, such as GaN dies for high-frequency, high-power RF power amplifiers in 5G and other critical military and aerospace wireless communications. AuLTRA 75 adjusts the final solder joint composition, improving wetting and voiding. This product line is also available in 78Au/22Sn and 79Au/21Sn compositions.

Indium Corporation's AuLTRA ThInFORMS are ultra-thin 0.00035" (approximately 8.89μm) 80Au/20Sn preforms that boost the operational efficiency of high-output lasers. They address issues like shorting—by reducing solder volume to minimise wicking up the die—and poor thermal transfer—by lowering the bondline thickness (BLT) to enhance thermal transfer and device longevity.

As a leading innovator in gold solder, Indium Corporation offers a comprehensive portfolio of gold-based materials, including wire, paste, preforms, spheres, shot, and ribbon. The most commonly used gold-based alloy is 80Au/20Sn, a cornerstone of the microelectronics industry with a melting point of 280°C, excellent thermal fatigue properties, high tensile strength, and high corrosive resistance. Indium Corporation's AuSn solder provides numerous advantages such as high tensile strength, compatibility with high-temperature reflow processes, superior thermal conductivity, and resistance to corrosion.

Additionally, Heat-Spring is a compressible, non-reflow metal thermal interface material (TIM), ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Heat-Spring avoids pump-out and bake-out issues due to its solid metal state and offers a sustainable solution through Indium Corporation’s indium reclaim and recycle program.