Indium Corporation to give three talks at APEC 2024

On Tuesday, 27^th February, from 1:30pm to 2:00pm PST, Product Manager for ESM/Power Electronics, Joe Hertline, will present on "Power Module Package-Attach Materials Technology". Hertline will discuss advancements and trends in power module package-attach materials technology, highlighting a pioneering Pb-free alloy that facilitates lower processing temperatures for preform soldering compared to SAC alloys. This innovation aims to mitigate warpage in package-cooler attach scenarios, maintaining reliability unlike traditional bismuth-containing low-temperature alloys. Further, he will explore sintering applications and the latest trends in thermal interface materials.

On Thursday, 29^th February, between 2:45pm and 3:10pm PST, Strategic Advisor Dongkai Shangguan will address "Material Considerations for Next Generation EV Inverter Architectures". Dr. Shangguan will examine the challenges presented by 800V inverter architecture, focusing on design considerations, thermal management, and material selection. He will pay particular attention to warpage and delamination issues, underscoring their significance for manufacturing, reliability, and safety of the final products.

Following closely, from 2:50pm to 3:10pm PST, Senior Applications Development Engineer Ryan Mayberry will discuss "Low-Temperature Pb-Free Solder Preform Technology for Molded Power Module Package Attach Designed for Improved Thermomechanical Performance". Mayberry will evaluate a low-temperature Pb-free soldering solution aimed at addressing the balance between cost, complexity, and performance in thermal and mechanical attach solutions for power modules. His discussion will centre on a SAC-In alloy solution in a solder preform configuration, offering a peak reflow temperature below ~215°C. This Bi-free alloy promises improved thermal performance and robust lifecycle performance in thermal shock testing at -40°C to +125°C, positioning it as an effective substitute for traditional high-temperature solders and organic-based thermal management solutions.

Joe Hertline, with a background in mechanical engineering and an MBA from Clarkson University, is a Certified SMT Process Engineer (CSMTPE) focusing on the growth of the power electronics product line at Indium Corporation. Dr. Dongkai Shangguan, a Strategic Advisor, brings his vast experience to bear on semiconductor packaging and SMT industries trends, holding multiple accolades and patents. Ryan Mayberry, leveraging his expertise in materials science and engineering from Rutgers University, N.J., supports the Engineered Solder Materials (ESM) product line with his knowledge in test strategies and application guidelines.

For more information on Indium Corporation’s innovative solutions for EV and power electronics, visit booth #752 at APEC.