Indium Corporation Showcases AI-Driven Material Solutions at SEMICON Taiwan

Indium Corporation's SiPaste series is specifically engineered for fine-feature printing, offering powder types ranging from Type 5 to Type 8. These pastes help avoid void formation, minimise slumping, and consistently deliver superior printing performance. The latest addition, SiPaste C312HF, provides exceptional stability over time while being easily cleanable with semi-aqueous or saponifier technology, making it a reliable choice for high-precision applications

The company’s Heat-Spring solutions are tailored for TIM2 applications. These compressible, non-reflow metal TIMs incorporate indium for outstanding thermal conductivity, achieving 86W/mK in all planes. Heat-Spring TIMs are designed to avoid issues like pump-out and bake-out, while offering a sustainable edge through Indium Corporation’s reclaim and recycling initiatives.

Indium Corporation’s GalliTHERM portfolio leverages over 60 years of expertise in gallium-based liquid metals. These liquid metal TIMs, suitable for both TIM1 and TIM2 applications, provide:

• High thermal conductivity for enhanced product longevity and reliability
• Low interfacial resistance, promoting efficient heat dissipation
• Exceptional wetting capability on both metallic and non-metallic surfaces

Visitors to SEMICON Taiwan can explore these innovations and more at Indium Corporation’s booth (#L0330) and discover how their materials are propelling AI advancements across industries.