Indium Corporation expert to present at Power Device & Module Expo at NEPCON

The presentation will explore trends in EV power electronics and the interconnect materials that enable them.

Interconnect materials play a major role in the efficiency and reliability of power electronics. The adoption of state-of-the-art wide bandgap die technologies such as SiC and GaN, require complementary die-attach materials to maximise the benefits. Higher power densities require new strategies for thermal management and heat dissipation. Packaging trends such as transfer molded modules and the direct bonding to heat-sinks and coolers is an area where different material and process options are considered, each with pros and cons for addressing the challenges of this application.

“As the world moves toward a greener, more sustainable future, the automotive industry is at the forefront of this transformation. EVs have emerged as a key solution for tacking carbon emissions which contribute to climate change, and at the heart of every electric vehicle are power electronics,” said Chou. “In this presentation, I will cover breakthroughs and trends that are shaping the power electronics landscape, especially for EVs.”

As Senior Area Technical Manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialisation in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.