Cured chemistry can withstand harsh environments
Engineered Materials Systems will exhibit in Booth #202 at ECTC 2015, scheduled to take place 26th to 29th May, 2015 in San Diego. Company representatives will showcase its DF-3000 series Negative Film Photoresists. The DF-3000 series is available in various thickness formats from 5-50µm, ±5%.
The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3000 series films are tougher than most negative photo resists on the market with a glass transition temperature of 158°C and a moderate modulus of 3.5GPa at 25°C.
It is hydrophobic in nature, providing for chemical and moisture resistance. DF-3000 series films are compatible with and can be used in contact with the EMS line of spin coatable photoresists. Company representatives will be available at the show to discuss Engineered Materials Systems’ full line of negative photoresists as well as conductive and non-conductive adhesives for semiconductor and circuit assembly applications.
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