Sequans Announces New LTE Reference Designs for Wireless Device Makers

SQN3120-USB reference designs can support all major LTE bands, initially including FDD bands 2, 3, 4, 5, 7, 13, 17, 20, and 25, and TDD bands 38, 40, and 41, with additional bands and unique multi-band combinations made available upon request. See Sequans and product information on the new reference designs at Mobile World Congress, stand 2G11, February 27-March 1 in Barcelona.

The reference designs are based on Sequans’ SQN3120 SOC, the chip at the heart of Sequans’ Mont Blanc LTE platform. Mont Blanc includes an integrated applications processor and is optimized for the design of hostless USB dongles, CPE, and mobile hotspots. The SQN3120-USB reference designs carry all the benefits of the SQN3120 chip, including its low power consumption and highly efficient 40 nm CMOS architecture, plus best-in-class RF and integrated antennas in a small form factor. For TDD bands, the reference designs incorporate Sequans’ SQN3140 RFIC, and for FDD bands, the designs incorporate RF partner Fujitsu’s MB86L12A RFIC.

“With these new reference designs we give our customers blueprints to build state-of-the-art LTE devices for virtually any LTE network, FDD or TDD, in the world,” said Georges Karam, Sequans CEO. “The reference designs continue our long tradition of delivering highly energy and cost efficient semiconductor solutions to wireless device makers everywhere.”

SQN3120-USB feature highlights

Supports all major LTE bands, FDD and TDD
Best-in-class RF performance
Optimized for hostless USB applications
Low power consumption
Ultra efficient MIMO decoder
Compact and versatile
Cost-effective, with reduced BOM
3GPP R9 and GCF compliant
UE Category 4 throughput, up to 150Mbps Dl / 50 Mbps UL
Complete LTE protocol stack and host software