Companies

Sequans Communications

  • Bâtiment Citicenter 19 Le Parvis de La Défense La Défense Cedex
    92073, Paris
    France
  • +33.1.70.72.16.00
  • http://www.sequans.com
  • +33.1.70.72.16.09

Sequans Communications Articles

Displaying 1 - 6 of 6
Design
27th April 2012
Sequans Announces New LTE Reference Designs for Wireless Device Makers

4G chipmaker Sequans Communications S.A. has made available new LTE USB dongle reference designs based on its second generation LTE semiconductor technology. The new family of SQN3120-USB designs can be used to build both FDD and TDD devices and they feature an ultra thin form factor, low power consumption, and a reduced BOM (bill of materials), enabling manufacturers to build sleek and powerful LTE USB dongles very cost-effectively.

Analysis
27th April 2012
Sequans joins Verizon’s LTE Innovation Program

4G chipmaker Sequans Communications has become a participant in Verizon’s LTE Innovation Center, created to empower LTE innovators and foster the development of new technologies for Verizon’s world-leading 4G LTE network.

Analysis
31st October 2011
Sequans Enters Agreement with Fujitsu Semiconductor

Sequans Communications S.A. has established a technology and marketing collaboration with Fujitsu Semiconductor Limited for the purpose of providing customers with a comprehensive, high-performance LTE product offering that combines Fujitsu Semiconductor’s multimode 2G/3G/LTE RF solution with Sequans’ just-announced, next generation LTE baseband solutions. The Fujitsu Semiconductor RF transceiver supports all major global bands and modes, inc...

Wireless
31st October 2011
Sequans unveils next-generation FDD and TDD LTE chips and global LTE platforms

Sequans Communications S.A. have introduced three new FDD and TDD LTE baseband chips, a companion RF chip, and two new LTE platforms, supporting all global FDD and TDD LTE networks. The chips represent the state of the art in LTE semiconductor technology. They are designed in 40 nm CMOS process technology and deliver industry-leading low power consumption and high performance in a very small form factor.

Analysis
20th June 2011
Sequans Ships Ten Millionth 4G Chip

4G chipmaker Sequans Communications S.A. have announced that it has shipped its ten millionth 4G chip. The announcement was made by Sequans’ CEO, Georges Karam after the Opening BellSM ceremony at NYSE Euronext Paris where Mr. Karam and his senior executives and founders were on hand to celebrate the company’s recent IPO and listing on the New York Stock Exchange.

Wireless
20th May 2011
Sequans Announces New WiMAX Chip for Handsets and Tablets

4G chipmaker Sequans introduced its newest Mobile WiMAX chip, the SQN1310, today at CTIA’s Wireless 2011 annual trade show. The new chip leverages the architecture and software of Sequans’ SQN1200 series technology while providing higher levels of integration, enabling a smaller design footprint and reduced system cost.

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