Samtec’s SIBORG speeds component launch designs

Initially intended to be used during design collaboration with experts in Samtec’s Signal Integrity Group (SIG), the tool can also be used independently to rapidly analyse different design variations in the connector breakout region (BOR) that affect signal integrity.

“It is imperative to understand electromagnetics and theory when optimising vias and launches for high-speed PCB design,” says Scott McMorrow, Chief Technologist for Samtec and the developer of SIBORG. “An automated tool, such as SIBORG, allows designers to make small changes to layer counts, geometry, and transmission line characteristics, and see how that impacts performance without engaging in extensive calculations. And, by standardising the variables used, SIBORG allows for more efficient collaboration between design teams.”

Variables that can be adjusted in the SIBORG tool include: dielectric variables, such as Dk; PCB manufacturing variables, such as the backdrill drill size; BGA pad geometry variables, such as centre-to-centre pitch between signal balls; via geometry variables, such as ground via pad diameter; antipad sizing variables, such as antipad in plane below trace layer; trace geometry variables, such as trace width; launch geometry variables, such as centre-to-centre pitch between signal vias; and BOR array generation variables, such as breakout direction vector. The Samtec SIBORG tool for Ansys HFSS currently supports 70+ variables in nine categories.

The SIBORG tool has easy-to-use drop-down menus to specify design parameters and generates images to allow engineers to quickly set up, visualise, and analyse the effects of changing the variables. The figure shows a screen shot from rendering a via-in-pad design. SIBORG tool can use all the capabilities of Ansys HFSS 3D Layout, including optimisation and plot generation.

After the design is optimised in SIBORG, the results and s-parameters can be transferred to other tools for end-to-end channel simulation. Or, the designer can export the final design into a comprehensive module of PCB BORs and package/connector 3D models.

Introduced during a tutorial session at DesignCon 2024, SIBORG, Signal Integrity Break Out Region Guru, modelling tool for Ansys HFSS can be requested through the Samtec website.