Indium Corporation introduces LED paste

LEDPaste NC38HF combines wetting performance with stencil print transfer efficiency to satisfy the range of process requirements for miniLED applications. It offers excellent printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturise.

LEDPaste NC38HF delivers:

• Consistent and tight solder deposit spread across multiple prints and excellent response-to-pause characteristics
• Minimal voiding on tight-pitch components, ensuring joint strength on small components
• Industry-leading non-wet open (NWO) performance using superior oxidation barrier technology, enabling reduced solder ball and solder beading defects and enhanced graping performance
• Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components

A proven product, LEDPaste NC38HF was recognised with an award for Excellent Product of the Year at the MiniLED conference in Shenzhen, China on November 10^th.

Indium Corporation is a materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.