Improved performance in MEMS microphone market

For this reason, applications that require highest performance microphones may have previously still used ECMs instead of MEMS. The IM73A135 reduces the need to compromise.

A 73 dB SNR and a high acoustic overload point (135 dB SPL) make for a very high dynamic range microphone with a small footprint of 4x3x1.2mm³. Infineon’s new MEMS microphone also features tight frequency curve matching for the most effective audio signal processing and the industry’s lowest power consumption of 170 μA. The IM73A135 thus allows designers to reach a level of high audio performance restricted to ECMs while at the same time reaping the benefits inherent in MEMS technology.

Infineon’s new MEMS microphone offers excellent characteristics to enhance active noise cancellation in headphones, a market that will grow to approximately 250 million devices by 2025 with a CAGR of 16%. Additionally, the low self-noise makes the IM73A135 especially suited for high-quality audio capturing required in conference systems, cameras, or audio recorders. A market that is also expected to increase significantly.

Infineon is not only expanding its portfolio of branded MEMS microphones but also adding a new low power digital ASIC technology. This lowest power technology will be used in various next-generation digital microphones manufactured and branded by the ‘Infineon-inside’ microphone partner network.

A low power mode current consumption of as little as 110µA makes it a perfect match for the wearables segment, including smartwatches and fitness bands. The growing demand for aesthetically appealing products with the ability to serve the consumers’ daily needs better will grow this market to reach approximately 650 million units by 2025, at a CAGR of almost 20% over a forecast period from 2020 to 2025.

The XENSIV MEMS microphone IM73A135 will be available for the distribution market in March 2021.