GDDR6 PHY IP on seven nanometre process technology

With ongoing engagements among design and verification customers, GDDR6 is applicable to a broad range of high-performance applications including networking, data centre, advanced driver assistance systems (ADAS), machine learning and artificial intelligence (AI). This fastest discrete memory interface from Rambus will add to TSMC’s large portfolio of silicon proven intellectual property (IP), design tools and reference flows.

Expanding beyond traditional GPU and graphic applications, GDDR6 helps to address market needs in multiple, high-bandwidth applications, as memory performance becomes more critical for overall system performance. 

By providing high speed of up to 16Gbps, while utilising established packaging and testing techniques, GDDR6 offers system designers an alternative memory choice that is reportedly five times faster than traditional memory available today. 

The Rambus GDDR6 offering will also add to TSMC’s portfolio of silicon-proven IP, via its Open Innovation Platform (OIP) IP Alliance Program. In this program, TSMC’s IP and ecosystem partners like Rambus are able to tapeout and validate in silicon critical IP for TSMC's various process nodes.

Features of the GDDR6 PHY:

• High speed of up to 16 Gbps, providing a maximum bandwidth of up to 512Gbps.
• Offers PCB and Package design support, allowing customers to quickly and reliably bring their high-speed designs to production. 
• Delivers a timing-closed hard macro solution for easy ASIC integration. 
• Provides access to Rambus system and SI/PI experts helping ASIC designers to ensure maximised signal and power integrity for devices and systems.
• Presents a LabStation development environment that enables quick system bring-up, characterisation and debug.
• Supports high-performance applications including networking, data centre, ADAS, machine learning and AI.

“By leveraging TSMC’s seven nanometre process technology, Rambus furthers its ability to offer first to market products and be on the leading edge of industry standards,” said Hemant Dhulla, VP and GM of IP Cores, Rambus. “We offer a complete system solution for integration, including PCB and package design, to help customers get to production faster. We’re excited to grow as a valuable ecosystem partner of TSMC and deliver a broad IP portfolio to maximise performance and flexibility for today’s most challenging systems.”

GDDR6 is available from Rambus today for licensing and integrating into system-on-chips (SoCs).