First COM-HPC and next-gen COM Express

OEMs will benefit from the substantial performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel Core processors deliver to the high-end computing sector. Typical applications can be found in many high-end solutions, from embedded systems and edge computing nodes to network hubs, and local fog data centres to core network appliances, as well as ruggedised central cloud data centres for critical government applications.

“congatec’s modules based on the 11th Gen Intel Core processors feature high-performance CPU/GPU compute with integrated AI acceleration for critical applications that demand high-speed processing, and computer vision,” explained Gerhard Edi, CTO at congatec. The highlights of the 11th Gen Intel Core processors provide a massive CPU performance boost, fast DDR4 memory, expansive PCIe Gen4 and USB 4.0 bandwidth.

These performance enhancements are complemented by features that are critical for communication connected edge computers such as congatec’s support for hypervisor technologies e.g. from Real-Time Systems. All this comes in a powerful and energy-efficient package leveraging Intel’s SuperFin technology delivering increased power savings, physical density and providing even more compute power for given thermal envelopes.

Andreas Bergbauer, Product Line Manager at congatec, added: “For the first time, design engineers now have the choice to go either with COM Express or COM-HPC. Each provide unique benefits for example, we have an improved next-gen connector for COM Express that is expected to offer better bandwidth capacities compared to what was available in the past.

“This is essential information for engineers thinking about utilising the high bandwidth interfaces such as PCIe Gen 4. Engineers choosing COM-HPC will benefit from by far more high-speed interfaces delivered over 800 signal pins in total. This is almost twice as many pins as COM Express Type 6 modules deliver with 440 pins.”