UV cure adhesive eliminates slider warpage
An ultra-low stress, lower glass transition temperature version of the 535-10M-1 UV cure adhesive, Engineered Material Systems has announced the 535-11M-3. The UV cured epoxy was developed to meet the rigorous reliability requirements of disk drive, camera module, photonics and circuit assembly applications.
Curing rapidly when exposed to high intensity UV light, 535-11M-3 is designed to eliminate any warpage of sliders in Head Gimbal Assemblies. It is also suit in other bonding applications in the Head Stack Assembly, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
The non-conductive adhesive is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.
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