Component Management
Low-temperature cure conductive adhesive
Engineered Materials Systems has announced its new EMS 618-116 Adhesive, a low-temperature cure one-part conductive adhesive designed for circuit assembly applications. EMS 618-116 is designed to cure in 30 minutes at 100°C or rapidly at elevated temperatures.
EMS 618-116 forms high-strength, high-reliability conductive interconnects and is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications.
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