Indium Corporation experts to present at APEX 2016

Dr Lee will present A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.

He will also present High Reliability Performance and Mechanism of Pressureless Sintering of Nano-Ag Paste for Die-Attach during the Nano-Materials (for PCB Fabrication and Component Die-Attach) technical session at 10:30 a.m. on March 17. This presentation discusses a novel silver paste that has been developed without any polymeric inclusion for the pressureless sintering die-attach process. This new paste has been designed to address the challenges of service temperature, thermal conductivity, electrical conductivity, and reliability in die-attach for high-power devices such as IGBT.