High strength epoxy does not contain antimony
Engineered Material Systems is pleased to debut its 535-11M-7 UV cured epoxy, which has been developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. The non-conductive UV cured adhesive is low outgassing,flexible, high strength and does not contain antimony and cures rapidly when exposed to high intensity UV light.
The 535-11M-7 is an ultra-low stress, lower glass transition temperature version of the 535-10M-1 UV cured adhesive. The epoxy can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
