Epoxy adhesive cures as low as 110°C

535-10M-49 is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. The material is designed to eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

This non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M-49 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony. 535-10M-49 was developed to pass the rigorous reliability requirements in microelectronic assembly applications. It is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, photovoltaic, circuit assembly, printer head, camera module, disk drive and photonic applications.