Engineered Material Systems Low-Temperature Cure/Snap Cure Conductive Adhesive
Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.
ECM CA-180 will cure in 30 minutes at 80°C or in seconds at 200°C, and has a moderate glass transition temperature (Tg) and modulus. CA-180 has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement. Unlike most conductive adhesives, CA-180 develops excellent conductivity with short, low-temperature cures. After curing for 30 minutes at 80°C, its electrical conductivity is 0.00006ohm-cm.
CA-180 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
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