Die attach epoxy cures in just 5-10 minutes
A one component epoxy system, which is designed for die attach applications, has been released by Master Bond. Offering an unlimited working life at room temperature, the Master Bond Supreme 3HTND-2DA cures in 5-10 minutes at 150°C. The adhesive, which performed well in 85/85 testing, has a die shear strength of 19-21kg-f.
Operating over a wide temperature range from -100 to +400°F, the 3HTND-2DA is a suitable adhesive for metals, ceramics and silicon dies. The epoxy is resistant to rigorous thermal cycling and shock.
The 3HTND-2DA passes NASA low outgassing test specifications, according to die attach application requirements. With less than 15ppm ionics, particularly chlorine, the adhesive features dimensional stability, high thermal conductivity, electrical insulation properties and a glass transition temperature of 100 to 105°C.
The Master Bond Supreme 3HTND-2DA is particularly suitable for automatic dispensing equipment. Providing a viscosity of over 300,000cps, the epoxy can be applied to a defined area without running.
The epoxy is offered in syringes and dispenses without any tailing. Refrigeration is required for the storage of the adhesive, which has a shelf life of 6 months when stored at 40-50°F.
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