Component Management

Conductive adhesive for small to medium size chip bonding

28th September 2016
Peter Smith
0

Engineered Materials Systems has announced a fast cure conductive adhesive for die attach applications with small to medium size die. Called EMS 561-338, it is designed to cure in less than one minute at 150ºC.

The adhesive is stress-absorbing to withstand the rigors of thermal cycling and is said to feature excellent conductive stability. The material can be applied by stencil printing or needle dispensing.

 

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