Featuring enhanced EMI shielding on the receptacle shell to help eliminate unwanted EMI leakage and provide enhanced performance over similar legacy products, TE Connectivity has introduced its USB Type-C connector. The do-it-all interface eliminates the need for multiple cords in a broad range of products from slim handheld devices to robust industrial applications.

Providing reliable and accurate measurement in harsh environments, TE Connectivity has introduced a backside compensated, headerless pressure sensor. The 86BC sensor is supplied in a 16mm diameter package, making it a compact, low cost solution for O-ring mounting or OEM applications where compatibility with corrosive media is required.

TE Connectivity has introduced three low-profile block connectors, including the 0.3H block SIM card connector, 0.3H block side-entry SIM connector and 0.3H block micro SD connector, which are recent additions to its SIM card connector portfolio for smartphones, wearables and other mobile devices. The block solution in these connectors provides flexibility for OEMs to create their own custom model designs for mobile and portable devices that need...

Featuring a new and improved housing design and an ergonomically designed handle to fit security enclosures, TE Connectivity has redesigned its EV charging cable assembly for Type 1, 32A. The cable assemblies offer high mating cycles and magnetically operated activated solid-state switches, as opposed to a mechanical switch, allowing for an increased life expectancy.

TE Connectivity has announced that its AMPLIMITE IP67 D-subminiature connectors meet IP67 performance levels. Designed to meet MIL-DTL-24308 specifications, the connectors have an environmental sealing that has been successfully tested at a submerged depth of one meter and have water and dust ingress protection to IP67.

TE Connectivity has announced that it has developed a proof of concept that allows traditional garment manufacturers to develop smart or connected textiles by easily integrating with the workspace and workflow used in traditional garment production. Through this process, garments produced can better survive the harsh conditions of normal wear, machine washing or dry cleaning.

TE Connectivity has released the KILOVAC KHR500 (Bubba II) high-voltage, high-rupture, 600 AMP contactor, which is smaller, lighter, and switches significantly higher power than its predecessor, the EV500 (Bubba I). Capable of handling inrush currents as high as 4000A, the device is hermetically sealed for use in harsh and explosive environments. 

The Raychem INSTALITE lightweight braid system, which offers up to 50% weight savings over traditional copper braids, has been introduced by TE Connectivity. Made from a high-performance, nickel-plated copper alloy, the RoHS-compliant pull-on braid provides better low-frequency performance than plated fibres or microfilaments.

Discover the trends shaping the future of wearables. Join Nick Langston Jr, Head of TE’s Wearables Lab, while he shares the upcoming trends in wearables and their impact on industries, technologies and devices for the future. Nick and his team are at the forefront of helping their customers and partners develop solutions for next-generation wearables.

Designed to be 30% smaller than conventional SAS interconnects, TE Connectivity's internal Mini-SAS HD connector and cable assemblies increase linear board density and save valuable PCB space. The high-speed interface is capable of transferring data at 192Gb/s (12Gb/s x 16 lanes) and has been been adopted by SAS 2.1 and SAS 3.0 specifications.

TE Connectivity has announced that it is delivering key connectivity solutions for Intel Omni-Path Architecture (Intel OPA) as part of Intel Fabric Builders program. Specifically, TE is providing its STRADA Whisper backplane connectors and cable assemblies, internal cable assemblies, and I/O connectors for Intel’s new switch and other products that are part of the Intel OPA.

Visions are emerging of the mobile networks of the future; by understanding how the respective technologies fit into the overall RAN picture, engineers will be able to implement these advances as they become available. By John Spindler, Director of Product Management, TE Connectivity.

TE Connectivity has announced the re-launch of its website, www.te.com, offering customers a better experience and easier access to more than 500 product categories, making it easier to find products that could be useful to their business.

TE Connectivity has announced that its FlexWave digital DAS Host Unit has achieved Network Equipment-Building System (NEBS) Level 3 compliance, meeting all telecommunications carrier standards for network equipment in central offices.

TE Connectivity has launched an interactive innovation platform called TE CONNECTED. The latest service, which is available in both English and German, provides engineers in factory and machine automation with current information on the latest technology trends and industry developments.

TE Connectivity has announced its FASTON terminal solution, made with an F-spring contact that offers improved retention, insertion, and contact-stability benefits compared with other solutions on the market. The terminal’s ergonomic features can help manufacturers provide safe and efficient assembly, which in turn results in end-product reliability and customer satisfaction.

TE Connectivity has introduced wire-to-board headers, expanding its Power Triple Lock connector product line, targeting appliances in a growing number of HVAC, automation, control and automotive designs. The connectors’ high current ratings, reliability options and higher temperature operation provide a value-added solution to customers compared with similar pin-and-socket connectors.

TE Connectivity is rapidly gaining traction with major US mobile operators, slashing DAS installation time, equipment costs and operating costs in key deployments. CPRI Digital Interface Unit (CDIU) establishes a direct digital connection between Alcatel-Lucent base stations and TE’s DAS host unit, eliminating remote radio heads, RF conversions and racks of attenuation panels in a DAS head-end.

TE Connectivity has announced that it will demonstrate a variety of optical networking products and advancements at OFC 2015 at the Los Angeles Convention Centre in Los Angeles, California. At the show, TE will release products, participate in the OFC FTTX Resource Center, and field more than half a dozen speakers for the conference, including a keynote speaker.

A micro SFP+ connector and cable assembly, which reduces space requirements on faceplates and PCBs in telecomms, data communications, networking and medical diagnostic equipment, has been released by TE Connectivity. The connector and cable assembly is up to 50% smaller in width and length than current SFP+ interconnects, enabling denser equipment designs.