Toshiba Electronics Europe has announced the European launch of a family of 600V MOSFETs with integrated high-speed intrinsic diodes. Based on the company’s fourth generation 600V super junction DTMOS IV process, the new MOSFETs will improve power efficiency in switching power supplies, micro inverters, adaptors, and photovoltaic inverters.

TEE has expanded its family of low-voltage, ultra-efficient MOSFETs with two new series that deliver the lowest ON resistance (RDS(ON)) in their class. The new miniature, 30V devices also offer very low input capacitance (Ciss) to ensure an excellent RDS(ON)*Ciss figure of merit (FOM). The MOSFETs are based on the company’s eighth generation U-MOSVIII-H process and supplied in miniature TSON Advance and SOP Advance SMD packages respectively

Toshiba Electronics Europe has announced two ultra-miniature, low-power CMOS load switch ICs that offer advanced switching functionality with reduced component count. These load switches with integrated MOSFET and control circuit offer a number of benefits against discrete switch designs.

In the drive for greater switching performance, new technologies including Deep Trench Superjunction Technology help support dramatic improvements in MOSFET efficiency. By Michael Piela, Senior Product Marketing Engineer in the Power Semiconductors European Marketing & Engineering Department at Toshiba Electronics Europe.

Toshiba Corporation today announced that it has launched a sub-power management IC embedded with a DCDC step-down convertor and LDO for use in mobile products such as cellular phones and smartphones that realizes high efficiency at a light load.

Toshiba America Electronic Components today announced the availability of a new lineup of load switch ICs for mobile devices. Featuring Toshiba's newly developed micro CMOS process, the new lineup features low voltage operation and low ON-resistance characteristics - in ultra-small packages.

Toshiba Electronics Europe has announced five new next-generation stepping motor control drivers. The new drivers are designed using the Toshiba BiCD 130nm mixed-signal process technology, providing excellent Ron per unit area.

Toshiba Electronics Europe has announced that Toshiba Corporation has started volume production of silicon carbide (SiC) power devices, in anticipation of growing demand for industrial and automotive applications. Production is at Toshiba’s Himeji Operations–Semiconductor, Hyogo Prefecture, Japan.

Toshiba has further expanded its family of CMOS area image sensors by offering a 1.12μm, 8 Megapixel device in an unpackaged, die format. The T4K05 integrates a number of features that support the miniaturization of camera modules, allowing designers to reduce the size and height of mobile devices.

Toshiba Corporation have revealed today that it will launch a vector engine embedded microcontroller with a low-pin count and wide pin pitch, which makes lower mounting costs possible, as the latest addition to the ARM Cortex-M3 core-based TX03 series line-up. Mass production of the new product TMPM372 will start in May 2013.

This paper looks at the trend in control electronics for high power stepper motors, used particularly in CNC machines, and describes a modern solution that delivers power, processing and cost efficiency, which should test if the high proportion of German Subcriptors is true. Germany is a strong industrial basis so we should have a high hit rate.

Toshiba have today announced that it will start to develop a new product line of embedded microcontrollers including an advanced motor control co-processor, the Vector Engine. In recent years, demand has grown for energy and energy efficient products. Toshiba is working on solutions to promote smart community in various areas, and semiconductors form an important part of this effort.

Toshiba Electronics Europe is pleased to announce today that it will offer a Full-HD, 1.12μm, back-side illumination CMOS image sensor featuring an integrated colour noise reduction circuit for applications including mobile phones and smart phones, PCs and tablet PCs.

Toshiba unveil the industry’s thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel imaging ideal for next-generation, ultra-thin smartphones and tablet devices. The new TCM9930MD leverages an advanced image pre-processing LSI (companion) chip and a refined module structure to create a compact image sensor camera module with the industry’s lowest profile at just 4.7 mm.

Toshiba Electronics Europe has extended its family of high-speed photocouplers for industrial applications. Supplied in a DIP8 package, the new TLP2955 and TLP2958 low-current drive devices provide guaranteed operation at temperatures from -40°C to 125°C. The TLP2955 and TLP2958 have a minimum isolation voltage of 5000Vrms and support data rates up to 5Mbps. Target applications include intelligent power module signal isolation, programmable log...

Toshiba Electronics Europe and Antix Labs have announced a collaboration that will enhance user experience and extend the monetization potential of games for content owners and distributors. As part of the cooperation, Toshiba can demonstrate how its recently announced TransferJet based accessory adapters work with the Antix Games Service to enable the fast and easy sharing of mainstream games across platforms and between users in a transparent, ...

Toshiba Electronics Europe has expanded its range of CMOS image sensors with a full HD device for the security/surveillance and automotive markets. The TCM5117PL 1080p device offers industry-leading >100dB high dynamic range (HDR), a fast frame rate of 60fps (at 1080p), and colour noise reduction (CNR) technology for better colour reproduction in low-light conditions.

Toshiba Electronics Europe has announced the first in a line-up of automotive MOSFETs that brings together the latest UMOS8 low on resistance (RDS(ON)), low input capacitance (Ciss) trench process with high-efficiency, high-reliability DPAK+ packaging. At just 2.4mΩ, the 40V, 100A TK100S04N1L has a maximum RDS(ON) that is 22% lower than previous devices with the same ratings.

Toshiba has announced that solid state drives built on the company’s 19nm Multi-Level Cell NAND flash technology are now readily available across Europe. Toshiba was the first company to develop 19nm NAND SSDs and the family includes the world’s smallest and highest density NAND flash drives.

Toshiba Electronics Europe has announced the European availability of a Structured Array technology. The technology provides an ASIC alternative to FPGA with lower cost and power consumption - but still at significantly lower implementation and sample/production turn-around time than standard ASICs.