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Toshiba Articles
New Photocoupler Provides High Breakdown Voltage And Current Amplification Over Extended Temperature Range
Toshiba Electronics Europe has announced a new photocoupler for use with programmable logic controllers (PLCs), I/O interface boards and home appliances. With a current transfer ratio of 1000% (min) and a minimum rated isolation voltage of 3750Vrms the TLP187 is ideal for programmable controllers that utilise 100VDC output modules.
Toshiba Launches World’s Largest Capacity Automotive-Grade HDDs
Toshiba Electronics Europe has launched a new series of automotive-grade hard disk drives (HDDs) to meet the increasingly demanding storage needs of the automotive sector. The MQ01AAD032C is the flagship model and houses 320GB[1] of storage in a 2.5 inch (6.4cm) HDD casing. The MQ01AADxxxC range also consists of the MQ01AAD020C (200GB) and the MQ01AAD010C (100GB) HDDs.
Toshiba Motor Driver IC Realises Zero Current In Standby Mode
Toshiba Corporation announce that it has today introduced a full-bridge DC motor driver IC, TB67H301FTG for use in consumer and industrial equipment, including printers, vending machines and amusement machines. The IC incorporates a standby function that realizes zero power supply current in standby mode. Mass production starts today.
Toshiba MCU Integrates Measurement And Communication Capabilities
Toshiba announce a new ARM Cortex M3-based microcontroller that combines large capacity memory with a range of serial interfaces, integrating measurement and communication systems into a single chip. The TMPM36BF10FG comes equipped with 258 kByte of SRAM and 1 MByte of ROM. TMPM36BF10FG is ideal for controlling complex systems that involve large software and data sets.
Toshiba Announces NFC LSI For Mobile Payments
Toshiba reveal today that it has launched an NFC controller LSI (CLF) T6NE2XBG for secure mobile payments via proximity wireless communication. Mass production is scheduled to start in October. The market for mobile payments, using smartphones and other mobile devices in transactions, is growing. The T6NE2XBG enables multiple concurrent connections with three different secure elements, allowing manufacturers to design NFC-enabled applications bef...
Toshiba Launches Next-Generation Solid State Hybrid Drives
Toshiba Electronics Europe has launched its next-generation solid state hybrid drives that combine SSD-like performance with large HDD capacities. The new drives squeeze 8GiB of NAND storage and up to 500GB of HDD storage into a svelte 2.5-inch form factor with 7.0mm height, ideal for high-performance and ultrathin notebooks, and slim line PCs.
Smaller Can Be Better: Toshiba’s Latest Photocouplers Offer Increased Voltage Isolation In A Smaller Package
Toshiba Electronics Europe has announced two new Triac-output photocouplers that provide reinforced voltage and electrical noise insulation in an ultra-miniature SO6 double-mould package. The TLP265J and TLP266J have a minimum rated isolation voltage of 3750Vrms and have been designed for use in triac drivers, programmable controllers, AC output modules and solid-state relays used in home appliances and white goods.
Toshiba Develops World’s First Multi-level-cell Structure MROM cell
Toshiba Corporation today announced that the development of the world's first MROM cell to offer improved cell current characteristics without any increase in cell size. This advance was achieved by adopting a multi-level-cell structure, which also secures high speed operation.
Toshiba Announce Development Of MOSFETs For RF/Analog Applications
Toshiba have today revealed the development of a high power gain transistor using a CMOS compatible process. The transistor efficiently reduces power consumption in high frequency RF/analog front-end application. Details will be presented on June 12 at the 2013 Symposia on VLSI Technology and Circuits, held in Kyoto, Japan, June 11-14, 2013.
Toshiba Adds High Gain 200W GaN HEMT Power Amplifier for C-Band RADAR Applications
Toshiba America Electronic Components today announced the addition of a 200W C-Band gallium nitride semiconductor High Electron Mobility Transistor to its power amplifier product family. The new device will be shown during the conference exhibition portion of the 2013 IEEE MTT-S International Microwave Symposium from June 4-6 in Seattle, Washington.
Toshiba Launches RF-IC For China ETC System
Toshiba has launched an RF-IC for the fast-growing China ETC market. Samples are available now with mass production scheduled to start from November 2013. ETC sets in China usually operate on battery power and requiring ICs that offer low power consumption and low voltage operation. The TC32168FTG also achieves low voltage operation, a fast boot sequence and dual channel reception.
Toshiba Electronics Expands Family of Ultra-Miniature Load Switches
Toshiba Electronics Europe has expanded its family of ultra-miniature, low-power CMOS load switch ICs. The TCK106G, TCK107G and TCK108G belong to the family of 1A switches that help to reduce the board space needed for power management circuitry in mobile phones, tablet PCs and other high component density portable applications.
Toshiba Electronics Announces 2-Channel ESD Protection Diode for Full-Speed USB 2.0 and RF Interfaces
Toshiba Electronics Europe has extended its line-up of low-capacitance ESD protection devices with the DF4D6.8UG. The DF4D6.8UG comes in a compact 4pin Wafer-Level-Chip-Scale Package and offers ESD protection for dual high-speed data lines while minimising board space. The device targets applications that are increasingly sensitive to ESD events due to reduced feature sizes and working voltages in the system.
Toshiba expands TX03 Microcontroller Family with New Energy-Efficient, Cost-Effective, Small-Footprint
Toshiba Corporation expands the Toshiba TX03 series microcontroller family with the launch of its newest TMPM375FSDMG device. Based on the ARM Cortex- M3 core, the TMPM375FSDMG MCU implements a next-generation vector engine that improves motor control, reduces component count, energy, and power consumption.
Toshiba's Proposal Reaches Major Milestone in IEC International Standardization for Smart Grids
Toshiba Corporation today announced that the International Electrotechnical Commission has endorsed a committee draft for vote of an International Standard, proposed by Toshiba, that will secure a much higher level of interoperability among subsystems in electricity transmission and distribution systems.
Toshiba Introduces Low RDS (ON) P-ch MOSFETs for Mobile Devices
Toshiba America Electronic Components has announced the addition of three new high current P-ch MOSFETs: the SSM6J505NU, SSM6J501NU and SSM6J503NU. Supporting high currents for high power dissipation packages, the new MOSFETs make ideal charging switches for smartphones and other mobile devices with high current charging circuits.
Toshiba Announces Availability of Latest Enterprise-Class HDDs and SSDs
Toshiba has announced full European availability of its latest Enterprise-class PX02SMx SSDs and MG03xxxx HDDs. These storage devices are ideal for a wide range of business-critical server and storage platforms as well as private cloud storage infrastructures.
Toshiba Reveal Next Generation NAND Flash Memory
Toshiba Corporation has announced that the company has developed second generation 19 nanometre process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month. Toshiba has used the new generation technology to develop the world’s smallest 2-bit–per-cell 64 gigabit NAND memory chips, with an area of only 94 square millimetres.
Toshiba’s Latest Photocouplers are Optimised for Mid-Speed Communications with Data Rates of 20kbps ~ 100kbps
Toshiba Electronics Europe has announced two new photocouplers that are optimised for RS-232 and RS232-C communications. The TLP2301 and TLP2303 address emerging requirements for devices that fill the ‘price/performance gap’ between general-purpose transistor couplers and IC couplers operating from 1Mbps. Target applications will include factory automation and other industrial systems, appliances, smart metering and building automation.
PCIM Europe: SiC Hybrid Power Module Rated at 1700V, 1200A
Toshiba Electronics Europe (TEE) has announced a hybrid N-channel IEGT (Injection-Enhanced Gate Transistor) module that features an embedded silicon carbide (SiC) fast recovery diode (FRD). The high-efficiency PMI (Plastic case Module IEGT) will help designers to save energy, space and weight in high-power switching, inverter and motor control applications.