Toshiba Electronics has announced a high-voltage intelligent power device (HV-IPD) that will improve the efficiency and reduce the component count of brushless DC (BLDC) motor drives.

Toshiba Electronics Europe's dual-mode Bluetooth Classic and Bluetooth Low Energy IC technology has been enhanced to offer Bluetooth LE4.2 (BLE 4.2) functionality. The dual-mode TC35661-551 simplifies the secure system design of a variety of Bluetooth-enabled products ranging from smartphone accessories and toys to healthcare equipment, industrial as well as automotive sensors and switch solutions.

Toshiba Electronics Europe expanded its extensive portfolio of diodes with the addition of six low reverse-current SBDs. With a peak reverse voltage of 40V, the new CCS15F40, CUS15F40, CBS10F40, CUS10F40, CTS05F40, and CUS05F40 are suitable for voltage boosting circuits in white LED backlights and for liquid crystal displays in mobile devices like smartphones and tablet PCs.

Toshiba Electronics Europe announces that Toshiba was the fastest growing vendor in both the worldwide $25 billion hard disk drive (HDD) segment, as well as in the $17 billion solid state drive (SSD) segment in 2016 over 2015, as measured by revenue and units. These accolades were recognised in two recent IDC reports: “Worldwide Solid State Storage Quarterly Update, CY 4Q16” and “Worldwide 4Q16 HDD Shipment Results and Four-Quar...

Delivering low on-resistance and high-speed performance, Toshiba Electronics Europe has expanded its U-MOS IX-H series of low-voltage N-channel power MOSFETs with new 40 and 45V products. The new products - nine 40V and five 45V versions - are designed for industrial and consumer applications, including high-efficiency DC/DC converters, high-efficiency AC/DC converters, power supplies and motor drives.

Toshiba Electronics Europe (TEE) has announced a comprehensive development kit that provides the hardware and software needed to create wearable devices that handle multiple sensor inputs. The EBTZ1041-SK-A1 ‘starter kit’ supports the prototyping of highly integrated IoT wearable applications featuring the Toshiba TZ1000 ApP Lite family of IoT processors. Toshiba’s new kit incorporates the company’s TZ1041MBG ‘s...

  It has been announced that Toshiba Electronics Europe's latest generation of Bluetooth Low Energy (BLE) System-on-Chip (SoC) technology (Generation2, 'G2') is the first to offer full compliance with the new features of Bluetooth version 4.2 specification. 

Toshiba Electronics Europe announced the availability of a line of CMOS logic ICs in small outline integrated circuit (SOIC) packages: the 74HCxxxD series. These products support flow and reflow soldering, and are suitable for industrial equipment and digital home appliances with logic levels of 6V and lower. The 63 new part numbers in the 74HCxxxD series consist of the most commonly used 74-series logic functions, bringing the total number of CM...

  Toshiba's range of high-efficiency U-MOS IX-H MOSFETs has been extended, with an N-channel device in a ‘DSOP Advance’ SMD package that offers double sided cooling.

Toshiba announced that it has started construction of a new state-of-the-art semiconductor fabrication facility, Fab 6, and a new R&D centre, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base. Fab 6 will be dedicated to production of BiCS FLASH, Toshiba’s innovative 3D Flash memory.

A new-generation transistor array for applications such as LED lighting and industrial, high-voltage signal transmitters has been launched by Toshiba Electronics Europe. The TBD62089APG incorporates 8-bit, D-type Flip Flop circuits that support a data storage function.

Toshiba has introduced three ICs, TC35678FSG, TC35678FXG and TS35679FSG, which support Bluetooth Low Energy (BLE) version 4.1 communications. They achieve low current consumption and are suitable for use in Bluetooth Smart devices, such as wearable technology, medical equipment, smartphone accessories, remote controls and a wide variety of emerging IoT solutions.

Two N-channel MOSFETs for load switches in mobile devices are claimed to deliver class-leading low on-resistance, according to Toshiba Electronics Europe.

The launch of Toshiba Corporation’s Storage & Electronic Devices Solutions's JEDEC e∙MMCTM Version 5.1 compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 requirements has been announced. The line-up offers densities of 8, 16, 32 and 64GB. Sample shipments have already started with mass production scheduled for the second quarter (April-June) of 2017.

A high-voltage, high-resolution bipolar stepping motor driver with maximum ratings of 40V and 1.8A has been introduced by Toshiba Electronics Europe. The compact TB62269FTAG will suit applications ranging from home appliances and industrial automation to 3D printers and ATMs. 

Toshiba announced the outline schedule for the construction of a state-of-the-art fabrication facility at Yokkaichi Operations in Mie, Japan, for expanded production of BiCS FLASHTM, its proprietary 3D Flash memory. Following on from the March announcement of its intention to build a new BiCS FLASHTM facility, the company decided to start construction in February 2017. The new fab will be dedicated to 3D Flash memory processes.

Two halogen-free photorelays have been introduced by Toshiba, offering minimum isolation voltage of 3750VRMS. The TLP172AM and TLP172GM are housed in 4-pin SO6 packages that can operate at a maximum temperature of +110°C. Both products can be used to replace mechanical relays and are suited to designs demanding high-performance switching, electrical isolation and extended temperature operation.

A 100V, 160A power MOSFET range has been launched by Toshiba Electronics Europe that delivers a tighter threshold voltage (Vth) specification than previous devices. A tighter threshold voltage specification is very important in switching applications and the TK160F10N1L offers min/max Vth of 2.5/3.5V versus its predecessor’s 2/4V range.

Two photocouplers, TLP2767 and TLP236, have been announced by Toshiba Electronics Europe for high-speed communications at data rates up to 50Mbps. TLP2767 is the first 50Mbps product in the industry to achieve both a creepage and clearance distance of 8mm and isolation thickness of 0.4mm for reinforced isolation.

The family of automotive power MOSFETs from Toshiba Electronics Europe has expanded with the TK1R5R04PB - the first device in its low-resistance D2PAK+ package. While the D2PAK+ has the same footprint as a conventional D2PAK (or TO-263) package, it offers reduced package resistance. This is thanks to a source pin that is much wider near to the mould surface than that of a conventional D2PAK.