Tensilica has revealed that it has joined the Wi-Fi Alliance. Tensilica also has leading customers using the Tensilica dataplane processors for some of the older Wi-Fi standards. Now Tensilica plans to integrate Wi-Fi with its multi-standard radio capabilities. Several of Tensilica's DPUs are ideal for Wi-Fi, including the popular ConnX D2 and the BBE DSP product family.

Tensilica, Inc. today announced that it is now ranked second in shipments of chips containing DSP IP cores for 2011 by The Linley Group. Tensilica attributes this growth to its focus on dataplane signal processing and strong unit volumes in smart phones, home entertainment, and communications LTE infrastructure. Shipments of devices with Tensilica DSP cores roughly doubled from 2010 to 2011.

Tensilica and VWorks today announced a partnership to provide virtual platforms based on Tensilica’s Xtensa dataplane processors (DPUs), dramatically reducing customers' embedded software development time.

Tensilica Inc. today announced that it has added support for the Dynamic Resolution Adaptation (DRA) standard to its library of over 100 audio encoders, decoders and sound enhancement packages for its popular HiFi Audio DSP (digital signal processor) family.

Tensilica, Inc. today announced that the ConnX BBE16 DSP (digital signal processing) IP (intellectual property) core has been licensed to Renesas Electronics Corporation for upcoming products for digital TVs.

Tensilica Inc. and Arkamys today announced that Arkamys digital audio software currently is being ported on Tensilica's HiFi Audio DSPs. This set of software is complemented with the availability of audio design and tuning services. Now designers of products for professional entertainment, digital content companies, and the consumer electronics industry - including mobile phones, tablets, MP3 players, car audio and home theaters - can use Arkamys...

After great success in the LTE (Long-Term Evolution) handset baseband market, Tensilica, Inc. today announced that it is driving the transition to LTE-Advanced and has already secured lead customers for its new product – the ConnX BBE32UE DSP (digital signal processor) IP core for baseband SOC (system-on-chip) designs.

Tensilica,Inc. today announced the HiFi 3 audio/voice DSP (digital signal processor) IP (intellectual property) core for SOC (system-on-chip) design. This fourth-generation audio DSP offers higher performance with lower power for high-performance audio post-processing and voice processing algorithms used in smartphone and home entertainment systems and expands Tensilica’s market-leading HiFi architecture to quad 24/32-bits. Tensilica has alre...

Tensilica, Inc. today announced that it will showcase innovations from customers that use the company’s dataplane processors (DPUs) in digital televisions (DTVs), Blu-ray Disc players, 4G handsets and data cards, and more at the 2012 Consumer Electronics Show (CES). For this show, Tensilica has doubled its space in the meeting room area of the South Hall of the Las Vegas Convention Center and will be located at meeting room MP25166.

Tensilica has announced that Skyviia Corporation has selected the HiFi Audio DSP core for its next-generation multimedia SOC (system-on-chip) designs. Tensilica's HiFi Audio DSP is the most popular audio DSP core on the market and is licensed by five of the top 10 semiconductor companies and many leading system OEMs.

Tensilica has announced that EnVerv has licensed cores from the ConnX DSP (digital signal processors) family for use in a power line communications system-on-chip chip design for smart grid applications. Tensilica’s ConnX DSPs are low-power, customizable dataplane processors (DPUs) that deliver outstanding performance on compiled C code, without the need for assembly code optimization.

Tensilica, Inc. today announced that the NatureDSP Math Library from IntegrIT DSP Design House, a leading supplier of DSP (digital signal processing) software solutions, is now available for Tensilica’s ConnX BBE16 baseband DSP for system-on-chip (SOC) design.

Tensilica, Inc. announced that Fraunhofer IIS, has joined Tensilica's Xtensions partner network and become an authorised design centre. Fraunhofer IIS will support mutual customers with their audio-related SOC (system-on-chip) designs.

Tensilica announced that it reached a milestone in May 2011 with the production of over one billion Tensilica DPUs (dataplane processor units). Tensilica's licensees are currently shipping at a run rate exceeding 500 million Tensilica DPUs per year, and Tensilica projects its customers will hit the two billion cumulative shipment mark by the end of 2012 - a doubling in volume in just 18 months.

Tensilica, Inc. has announced that it is extending its leadership in IP cores for compute-intensive dataplane and DSP functions such as imaging, video, networking and baseband wired/wireless communications. Any application that requires extensive data processing will significantly benefit from the breakthrough features - particularly those that quadruple data bandwidth - built into Tensilica's new Xtensa LX4 dataplane processor (DPU) for SOCs (s...

Tensilica announced that it is the first audio IP core supplier to be awarded DTS Broadcast and DTS DMP (Digital Media Player) certification. The certification, achieved using fully optimized software implementation on Tensilica's HiFi 2 and HiFi EP Audio DSP (digital signal processor) IP cores, provides developers of SOCs (system on chips) with a proven solution that reduces the time to market for new, fully compliant designs. Tensilica was als...

Tensilica announced that it is extending its leadership in IP (intellectual property) cores for compute-intensive dataplane and DSP (digital signal processor) functions such as imaging, video, networking and baseband wired/wireless communications.

Tensilica should stand out at this year's Mobile World Congress (MWC) in Barcelona, February 14-18, 2011, as it has moved into the number one position as the supplier of baseband DSP (digital signal processors) IP (intellectual property) cores for the new generation of 4G LTE (Long Term Evolution) equipment. Eight of the top 15 LTE chipset manufacturers are working with Tensilica's cores for their designs.

Tensilica extended its BaseBand Engine (BBE) family with the ConnX BBE64-128 - the next-generation architecture for DSP (digital signal processor) IP (intellectual property) cores for SOC (system-on-chip) design. The ConnX BBE64-128 provides over 100 GigaMACs performance in 28nm high-performance process technology, easily outperforming all other DSP IP cores on the market. The ConnX BBE64-128 was designed to meet the performance requirements for ...

Tensilica announced that all the optimized programmable DPUs (dataplane processing units) of its Atlas Reference Architecture are now available for customer evaluation. The Atlas Reference Architecture uses the Tensilica ConnX BBE16 baseband DSP (digital signal processor) core coupled with three function-specific dataplane processor cores (DPUs) to allow the baseband PHY (physical layer) SOC (system-on-chip) developer to create a very low power a...