Samtec has expanded its line of edge card connectors with 0.80 and 1.00mm pitch sockets designed for higher speed applications and optimal mating alignment. The 0.80mm pitch socket (HSEC8-DP series) is a differential pair version of Samtec’s popular Edge Rate 0.80mm pitch sockets. Rated for speeds to 28Gbps NRZ/56Gbps PAM4, the socket features Edge Rate contacts designed to increase cycle life and decrease crosstalk.

  Global manufacturer of a broad line of electronic interconnect solutions, Samtec, has announced the release of two new VITA 57.4-compliant FMC+ Loopback Cards. These new solutions provide FPGA designers easy to use loopback options for testing low-speed and high-speed multi-gigabit transceivers on any FPGA development board or FPGA carrier card.

Samtec has announced the release of the new 14 Gbps FireFly FMC Development Kit. This new solution offers an easy-to-use evaluation and development platform for Samtec’s FireFly optical engines. The 14 Gbps FireFly FMC Module provides up to 140 Gbps full-duplex bandwidth over 10 channels from an FPGA to an industry-standard multi-mode fiber optic cable.

Samtec has announced the Consortium for On Board Optics (COBO) has adopted a two-piece surface mount connector system based on Samtec’s FireFly Micro Flyover System for the next generation of standardized on-board optical modules. As part of the new miniature footprint, the Power/Control connector from Samtec reduces the size of on-board optical modules while increasing port density in data center and HPC applications.

Samtec has announced the expansion of its line of standard and custom AccliMate sealed cable plugs and receptacles, including new crimp sealed bayonet latching circulars. These systems meet IP67/IP68 requirements for dustproof and waterproof sealing and are designed for industrial, outdoor, underwater and other harsh environments.

Samtec announces the release of the first Samtec nMode Wireless Sensor Module. The production-ready solution allows engineers to remotely sense and measure inertial, environmental and acoustical parameters. Samtec’s 13.5mm x 13.5mm nMode Wireless Sensor Module contains a MEMS accelerometer, gyroscope, magnetometer, pressure sensor, and a MEMS microphone —all from STMicroelectronics, a global semiconductor leader serving cust...

Samtec is participating in next year’s DesignCon 2017 conference and exhibition at the Santa Clara Convention Centre 31st January to 2nd February. Samtec’s Director of Signal Integrity Jim Nadolny will be presenting a 45 minute technical paper session covering ‘Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.’

Samtec has released a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. Samtec’s FMC+ connectors help support the expanded interface and faster speeds of FMC+ applications.

An extended temperature version of Samtec's FireFly Active Optical Micro Flyover Cable Assembly has been released. The ETUO series supports temperature ranges of -40 to 85°C. The ETUO series shares the core features of Samtec’s existing ECUO series FireFly Active Optical Micro Flyover Cable Assembly. 

The technical collaboration between Samtec and PLDA provides a groundbreaking solution for PCIe 4.0 endpoint development by combining PLDA’s PCIe 4.0 hardware and IP with the Samtec’s PCUO PCIe Optical Flyover Cable Assembly. The PLDA PCIe 4.0 Platform Development Kit (PDK) is a complete development platform based on PLDA’s PCIe compliant XpressSWITCH IP and PLDA’s XpressRICH4 controller IP for PCIe Gen...

Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, announces the expansion of the ExaMAX High-Speed Backplane Connector System optimised for high-density and high-speed performance. The scalable ExaMAX system meets today’s data rates while providing a future-proof path for next generation architectures.

Samtec has announced its entrance in the Silicon Photonics Program of the IRT Nanoelec, headed by CEA-Leti. Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialise optical communications solutions using silicon photonics technology for addressing data centres and high-performance computing applications.

Free seminars will be on offer at Samtec’s stand during the electronica exhibition in Munich (Nov 11-14).  The seminars focus on high speed interconnect design considerations, and will be presented by Scott McMorrow, President and SI Consultant of Teraspeed Consulting. They are 20 minutes in duration. Reservations are not required, and time will be available afterwards for questions and discussion.

Samtec’s new SMP jack and plug interfaces are a cost-effective solution for high frequency performance with limited space. These interfaces are ideal for testing applications where a tight, secure connection and high cycles are required, as well as for rugged, high vibration environments such as military, aerospace and mobile technology.

Samtec’s robust PowerStrip/35 Discrete Wire Cable Assembly offers rugged features and is ideal for high performance applications. When mated with Samtec’s PowerStrip/35 high power terminal (PET Series), the system has a current carrying capacity of 28.9A per contact at an ambient temperature of 75º C (with 2 gold plated pins energized and 10 AWG cable).