Soldering fumes, aerosols and solid particles (residues) have to be removed from the process cycle and are also produced when soldering electronic assemblies. Rehm Thermal Systems has recognised effective residue management for reflow convection soldering with the VisionXP+.

Rehm Thermal Systems has been present in sales and service partners in North America and Latin America for several years. Large automotive suppliers and global electronics manufacturers are increasingly located in Mexico. Rehm has taken account of this development and established its own branch office in Guadalajara in 2014 for distribution, spare parts supply and service.

'Manufacturing in the age of digital transformation' was the theme of this year’s Technology Day on 29th September 2016 at Rehm Thermal Systems. With almost 150 guests, including regional and international clients, distributors and partner firms, the event was a resounding success. 

Rehm Thermal Systems looks forward to meeting you at this year’s SMT/Hybrid/Packaging in Nuremberg from April 26th to 28th, Europe's leading trade fair for system integration in microelectronics. The electronics industry continuously meets new challenges in the processing of sensitive electronic components – from processing the smallest components, the highest standards in void-free solder joints and increased quality through resistan...

To ensure sensitive electronic components function reliably even in adverse conditions, protective coatings are applied to circuit boards during the manufacturing process. In addition to its RDS Series, Rehm Thermal Systems is now offering two systems for the optimal hardening of such protective coatings – the vertical dryer RVDS and a compact UV hardening system.

Electronic components in safety-relevant applications such as medical, automotive and aerospace technology must function 100% reliably under all temperature conditions. To analyse the reliability of electronics under extreme temperatures, Rehm Thermal Systems has developed a completely new series: Securo Plus for hot function tests and Securo Minus for cold function tests. The systems can simulate precisely these extreme environmental conditions ...

As well as a water-cooled standard solution with adjustable ventilation system, there are several additional options for large and high-mass boards, primarily a power cooling unit as an extended cooling tract or a bottom cooling system. The Rehm company has also designed the first coolant-water-free reflow soldering system, which utilises liquid nitrogen cooling. Rehm's VisionX range transforms the classic cooling tract into a two or four-layer s...

Fine workmanship down to the smallest components, the highest standards in void free solder joints, increased quality through resistance coating, or safe operation under extreme temperatures, the electronics industry continuously meets new challenges in the processing of sensitive electronic components. Rehm Thermal Systems already offers appropriate solutions and will be presenting them from 10th to 13th November 2015 at Productronica in Munich.

They are barely visible to the naked eye and have names like 03015 or 01005, but they are achieving great new things in the world of electronics. The smallest of components, such as microchips, capacitors and resistors, are gaining ground when it comes to the manufacturing of electronic products. They offer new technological solutions and challenge the industry to make compromises, so as to keep up-to-date with the trend towards miniaturisation.

On display at SMT Nuremberg for the first time will be Rehm Thermal Systems’ VisionXP+ . Visitors to Hall 7, Stand 7-329 will be able to see yet another creative development from the award-winning Rehm, designed to enhance convection reflow productivity and boost energy efficiency. The VisionXP+ can reduce energy consumption by up to 20%.

The team at Rehm Thermal Systems have been celebrating at Apex following their successful win at Apex for their Vision XP Quad Lane Convection Reflow Oven. The Awards are designed to recognize leading new products during the past 12 months. An independent panel of practicing industry engineers selected recipients.

Rehm Thermal Systems announces its next-generation advanced packaging and semiconductor solutions with no atmosphere – the Vacuum Soldering process. Rehm offers three VS Series Vacuum Soldering system models. They’re all small, all powerful, and all low cost. The VS320, the VS160UG, and the VS160S benchtop each feature fast heating and cooling rates with easy profile setup and editing plus data logging.

Rehm Thermal Systems will showcase its newest vacuum soldering technology at this month’s Semi Con West and Intersolar exhibitions in San Francisco. Members of Rehm’s technical team will be on hand at the booth of American business partner Technica USA (#5757) to explain the numerous advantages available from this enabling technology.

Rehm Thermal Systems reports that last month’s SNEC 2012 in Shanghai was highly successful in spite of recent softness in the PV market. Rehm’s ongoing initiatives reflect a strong determination to expand upon their past successes and achieve leadership recognition for their PV technology achievements.