The Nexus contact soldering system from Rehm Thermal Systems guarantees best results in reflow soldering processes using contact heat under vacuum. This enables the Nexus to meet the highest requirements in the field of advanced packaging and power electronics. The contact soldering system with a vacuum is also bespoke for void-free soldering of different components (e.g. IGBT) on DBC substrates.

Every electronics manufacturer wants flawless reliable soldering and precise documentation of all production-related processes. But how can you ensure that the printed circuit board has actually been processed in compliance with the prescribed regulations? Rehm Thermal Systems has developed ProCap software for this purpose. The tool monitors the stability of the reflow process for each individual product, thus enabling optimal process traceabilit...

Rehm Technology Academy starts again after the summer break in September with webinars on different topics. Do you want to update your knowledge and have little time? Then take the opportunity to listen to interesting lectures from the world of electronics manufacturing with little effort. With Rehm Thermal Systems you will get a comprehensive overview of the manufacturing processes in the electronics industry as well as product demos of the corr...

The ProtectoXP and ProtectoXC dispensing and coating systems by Rehm Thermal Systems protect electronic assemblies from aggressive environmental influences such as moisture, corrosion, chemicals, dust or vibration. Coating the circuit board after soldering protects the functionality of the electronic assemblies, which may, for example, be used in technical end products of critical safety importance, such as in the automotive, aviation or medical ...

Rehm has announced that goal to keep everyone well informed in these times by providing webinars on the pros and cons of soldering with nitrogen, the ViCON system software by Rehm, vacuum soldering with condensation and contact soldering processes, as well as dryer solutions.

For an optimal reflow soldering result, not only is melting of the solder important but also as a stable and reliable cooling process. This soldering process can be designed flexibly with the VisionXP+ convection soldering system from Rehm Thermal Systems with the CoolFlow option.

The VisionXP+ convection soldering system by Rehm Thermal Systems has provided the basis for good soldering results with its optimum heat transfer properties, even if the electronic components have different requirements with regard to your production process.

With the ViCON system software, Rehm Thermal Systems has developed a user interface that enables the user to work intuitively. ViCON has now been redesigned for the special requirements of the dispensing and conformal coating systems of the Protecto series (ViCON Protecto).

Modern electronics are used nowadays in a range of industries and are therefore exposed to the most widely varied temperatures. Most notably, electronic assemblies in safety-related areas of application, such as medical technology, the automotive industry and aerospace technology, must function 100% reliably at all temperatures. 

UV coatings and UV adhesives facilitate fast hardening in just seconds, ensure short cycle times and increased production speeds and successfully connect environmental and economic benefits. There are also qualitative aspects in addition to this, such as a high level of gloss, as well as the increased durability and scratch resistance of the surface.

With ViCON, Rehm Thermal Systems has designed and created software that meets all the requirements of modern, networked, and above all, future-orientated electronics manufacturing. The core feature of ViCON software’s development lies in the option of accessing the software from a variety of devices. 

The demand for high-performance electronics is growing worldwide, driven by higher demand from for example the electro-mobility and LED global lighting industries. These different electronic applications require solder joints with as few voids as possible in both their structure and connection. 

Plumbing the depths of reflow technology with the specialist books of Dr Hans Bell (Rehm Thermal Systems): in the wake of four successful volumes, the publication of the fifth marks the final part in the Rehm series ‘Reflow technology – Fundamentals of Reflow Soldering’. 

Trade fair for the electronics industry, SMTconnect (formerly SMT Hybrid Packaging), will be opening its doors in Nuremberg from 7th to 9th May. Rehm Thermal Systems has announced that it will be attending again this year, and will be found in Hall 4A, at Stand 100.

In modern electronics manufacturing it remains important to protect sensitive assemblies from external influences, reliably, safely and as well as possible. Yet continuing development and miniaturisation in electronics are creating ever more complex assemblies that call for an even more precise level of protection. 

A collaboration that benefits electronics manufacturers around the world: That is what the cooperation between Rehm Thermal Systems and Electrolube is all about. The perfect interaction between coating systems and lacquers ensures optimum results during jetting, dispensing, spraying or curtain coating.

Rehm will be attending productronica in India for the first time in September (14 to 16). The international electronics industry is focusing on India as a growth market for innovation and is playing host to discussions about the latest production strategies and technologies. India, second only to China, is one of the most populous countries of the world with nearly 1.3 billion people. In addition to this, India is also considered to be one o...

In order to be able to more closely inspect the quality directly after the printing or painting process, two new inspection systems of the TROI series from Pemtron are now in use at the Rehm Technology Centre in Blaubeuren. In Germany, the Korean equipment manufacturer is distributed by ANS answer elektronik.

  This April, Rehm Thermal Systems will appear at two major international trade fairs in Asia – both in the world city of Shanghai. Visit at SNEC from 19 to 21 April or NEPCON China from 25 to 27 April.

Following Rehm Thermal Systems’ debut as an exhibitor at last year’s ElectrontechEXPO, the German engineering company will again present the latest equipment for efficient electronics manufacturing at the trade fair in Moscow in 2017. From 25th to 27th April, Rehm will be exhibiting at booth B419, with a focus on highly selective, innovative coating technologies and optimum protection of sensitive electronic assemblies.