NXP announced the release of the UJA107xA family, its next generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. Offering enhanced EMC (Electromagnetic Compatibility) performance, the chips meet the stringent requirements of global car OEMs such as Audi, BMW, Daimler, Ford, Porsche, Renault, Toyota and Volkswagen.

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NXP announced the availability of the MPT612 – a unique low-power IC dedicated to performing the Maximum Power Point Tracking (MPPT) function for applications using solar photovoltaic (PV) cells or fuel cells. Supported by a patent-pending MPPT algorithm, the MPT612 IC can deliver up to 98-percent efficient power extraction in applications such as solar battery charge controllers, distributed MPPT and micro-inverters.

NXP Semiconductors and EE Times have completed the Cortex-M0 LPC1100 Design Challenge by announcing the final four winners. The challenge resulted in over 500 LPCXpresso enabled designs from over 40 countries and has fostered a social community with 1600 members and received over 25,000 unique web visitors. All qualified contestants received LPCXpresso development systems with integrated LPC-Link which provided a common Eclipse based platform for...

NXP announced that its SmartMX secure contactless microcontroller chip has been chosen to power the new German contactless National Identity card (Neuer Personalausweis). The German government has selected NXP as the supplier of an inlay solution containing a dedicated SmartMX chip, packaged in an ultra-thin module. Issuance of German contactless ID cards, which will replace the current paper-based IDs, will start in November 2010. More than 60 m...

NXP Semiconductors N.V. announced today the publication of its Sustainability Report for 2009. The report, “High Performance Mixed Signal: Innovations for a better tomorrow,” explains how NXP products are helping to enable society as a whole to reduce energy consumption; describes the performance of NXP itself with regard to sustainability; and outlines how the company is working toward sustainable growth in the future.

NXP Semiconductors today announced the availability of the industry’s first high-speed multiplexer/switch to support USB 3.0 and PCI Express Gen 3, providing switching speeds of up to 8 Gbps. The CBTU04083 high-speed switch from NXP also supports other emerging standards including 6 Gbps SATA/SAS and DisplayPort v1.2 HBR2 at 5.4Gbps. By supporting these new standards, the NXP CBTU04083 multiplexer/switch makes it straightforward for system desi...

NXP Semiconductors today announced its acquisition of Jennic, a leading developer of low power RF solutions for wireless applications in smart energy, environment, logistics and consumer markets. The acquisition will see Jennic's state-of-the-art portfolio of 802.15.4 and Zigbee low power RF solutions integrated across a wide range of NXP's High Performance Mixed Signal products. Together, this provides NXP with a comprehensive wireless semicon...

NXP Semiconductors today introduced the NXP iPhone application, allowing access to NXP products and support easier and faster than ever before. This free application allows engineers to search, buy and share more than 10,000 products parts from NXP’s High Performance Mixed Signal and Standard Products portfolio anytime, anywhere on their Apple iPhone, iPad and iPod Touch.

NXP Semiconductors today announced the appointment of Simon McLean as Vice President of Marketing for the company’s Standard Products business. Simon joins NXP with over 16 years of management experience within electronic components distribution and manufacturing. He will be responsible for helping drive NXP’s Standard Products business.

NXP total sales were between $1,190 and 1,200 million in the second quarter of 2010, reflecting comparable growth of between 5.5% and 6.4% and nominal growth of between 2.1% and 3.0%, as compared to the first quarter of 2010. The increase was visible across all business segments and regions.

NXP Semiconductors today announced that it has shipped its 30 millionth low-IF tuner for car radios. The TEF66xx family of highly integrated tuners offers a broad range of options for both aftermarket and OEM manufacturers: from the low-cost TEF662x series for the cost-sensitive analog car radio market, to the high-performance TEF660x and TEF661x series, which offer different feature sets and price points to address a wide range of requirements i...

NXP Semiconductors announced that their jointly developed Near Field Communication (NFC) reader / writer module “TN33MUE002L” has been adopted by Lenovo in three ThinkPad laptop models for the global market: the T410, T510 and W510. When built into a PC or a peripheral device, the module solution supports a variety of security and convenience features enabling transactions such as online banking, E-commerce, E-government online access and sec...

Seven leading players in the Near Field Communication (NFC) ecosystem, Ericsson, Gemalto, NXP, Oberthur Technologies, STMicroelectronics, Venyon, a company in the Giesecke&Devrient group, and ViVOtech, today joined forces to form the MIFARE4Mobile™ Industry Group. The aim of the group is to enable its members to collaborate and work together to standardize and advance the uniform management of MIFARE™ applications on NFC-enabled secure elemen...

NXP's AC main LED driver IC family and software support.

NXP Semiconductors today announced the extension of its Transient Voltage Suppressor (TVS) diodes portfolio by 35 new products housed in its 2-lead FlatPower package SOD128 (3.8 x 2.5 x 1 mm). NXP is the first supplier to offer a 600W peak pulse power rating (10/1000μs) TVS diode in such a small plastic SMD package. Alternative 600W TVS products in the market are only available in much larger packages like SMA or SMB. The new SOD128 FlatPowe...

NXP Semiconductors today announced the opening of the high performance radio frequency (RF) product creation center (PCC) in Billerica, Massachusetts, U.S.A.

NXP Semiconductors has reached a major milestone by shipping its two millionth FlexRay transceiver. This milestone comes in less than a year of announcing its one millionth transceiver shipment. With this achievement, NXP upholds its industry leadership in in-vehicle networking technologies by being the only chip provider to ship over two million FlexRay Physical Layer compliant transceivers.

NXP Semiconductors today announced that its contactless microcontroller IC, MIFARE Plus™, has been adopted by the Turkish highway card-based automated toll scheme, Kartlı Geçiş Sistemi (KGS). This high-profile volume rollout implemented by the Turkish system integrator Aselsan will see NXP supplying over two million MIFARE Plus chips for the scheme annually. KGS is the most recent example of how NXP’s contactless MIFARE Plus techno...

NXP Semiconductors today announced that the new Audi A8 will feature In-Vehicle Networking (IVN) technology powered by NXP‘s FlexRay, CAN, LIN and SBC transceivers, enabling a series of new applications such as advanced driver assistance systems, adaptive cruise control and active chassis stability system. NXP&lquo;s IVN technology connects numerous electronic devices in a car using a wiring harness that consists of few lightweight copper cable...