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NXP Semiconductors Netherlands B.V.

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries

NXP Semiconductors Netherlands B.V. Articles

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Analysis
10th November 2010
NXP and Partners Kick Off European eCall Trial to Enable Faster Emergency Response Times

At the electronica 2010 conference in Munich today, NXP Semiconductors N.V. (Nasdaq: NXPI) and its partners will launch a pan-European field trial of the eCall emergency system, which automatically calls emergency operators in the event of a road accident. eCall sends vital data such as the time of the accident and the GPS coordinates of the accident point, and the number of vehicle occupants to a Public Safety Accident Point (PSAP).

Analysis
9th November 2010
NXP Showcases Smart, Energy-Efficient Chips

At electronica 2010 this week, NXP Semiconductors N.V. (Nasdaq: NXPI) will highlight how semiconductors are enabling a new level of energy efficiency across key application areas including lighting, automotive, solar power and power supplies, as well as smart appliances, buildings and homes. NXP is showcasing a selection of its smarter chip solutions offering excellent ROI in terms of energy savings (Hall A4, Stand 542).

Analysis
9th November 2010
NXP to Drive Automotive LEDs With Automotive-Qualified Technology

NXP Semiconductors N.V. (Nasdaq: NXPI) today announced the availability of fully integrated, highly flexible driver IC solutions designed for vehicle LED headlights and tail lights, based on automotive-qualified technology. The ASL1010NTK and ASL1010PHN are the industry’s first automotive LED driver ICs to integrate critical functionality such as direct LED temperature feedback, LED fault detection, internal PWM control for dimming, and short c...

Analysis
2nd November 2010
NXP Semiconductors Announces Third Quarter 2010 Results

NXP Semiconductors N.V. (Nasdaq: NXPI) today reported financial results for its third quarter 2010, and provided guidance for the fourth quarter. “The third quarter represented our sixth consecutive quarter of growth and significant operational improvement, as we continue to execute on our High Performance Mixed Signal solutions strategy,” said Richard Clemmer, NXP Chief Executive Officer. “Compared to the year ago quarter, revenue was up 2...

Analysis
2nd November 2010
NXP’s New Dual-Core Cortex-M4 and M0 MCU Redefines Digital Signal Control

NXP Semiconductors announced the LPC4000 family, the world’s first asymmetrical dual-core digital signal controller architecture featuring ARM® Cortex™-M4 and Cortex-M0 processors. The LPC4000 brings the advantage of developing DSP and MCU applications within a single architecture and development environment. With this dual-core architecture and a set of unique configurable peripherals, the LPC4000 enables customers to develop a wide range o...

Analysis
2nd November 2010
NXP - First Leadless Package With Tin-Plated, Solderable Side Pads

NXP Semiconductors announced the availability of SOD882D, the industry’s first leadless package with solderable, tin-plated side pads. The SOD882D is a 2-pin plastic package measuring only 1mm x 0.6mm and is ideal for small and thin devices. With a height of only 0.37 mm (typical), it is also one of the flattest packages in the 1006-size (0402 inch) and is available in various ESD protection and switching diodes.

Automotice Microsite
22nd October 2010
NXP to develop cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management in Singapore

NXP Semiconductors N.V. today announced that it is developing a cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management, which can help address the challenge of traffic congestion in Singapore. Expected to be deployed in 2012, NXP will develop innovative technologies based on NXP’s next-generation Automotive Telematics On-board Platform (ATOP). Singapore will be a test bed for ATOP, leveraging the city’s world...

Micros
22nd October 2010
NXP LPC1100L and LPC1300L MCUs Based on ARM Cortex-M Series Achieve Industry’s Lowest 32-Bit Operating Power

NXP Semiconductors N.V. today unveiled its LPC1100L and LPC1300L microcontrollers, which have set new benchmarks in 32-bit active power consumption. The LPC1100L and LPC1300L series introduce a new low-power platform which combines ultra-low leakage design techniques with NXP’s optimized power-efficient libraries. In addition, the MCUs feature unique API-driven power profiles which provide users with ready-to-use power management templates. By ...

Analysis
10th October 2010
LA Metro selects NXP's MIFARE Ultralight technology for paper ticketing

NXP Semiconductors N.V. (Nasdaq: NXPI) today announced that Los Angeles County Metropolitan Transport Authority (LA Metro) will begin circulating single and limited-use paper tickets that will use NXP MIFARE Ultralight™ contactless chip technology within its existing automatic fare collection infrastructure.

Analysis
10th October 2010
NXP Scores Gold for its Innovative Website and Marketing Campaigns

NXP announced that it has won two leading industry awards for its website and online marketing activity – the 2010 WebAward for outstanding achievement in web development and MediaPost’s Online Media, Marketing & Advertising (OMMA) Member’s Choice Award for the best integrated online campaign.

Tech Videos
1st October 2010
NXP's RF power transistors for broadcast, ISM and defense and aerospace applications

Scott Blum describes a number of NXP's high power RF transistors and their respective outstanding properties for broadcast, ISM and defense and aerospace markets and applications.

Tech Videos
1st October 2010
NPX's Doherty RF power amplifiers for cellular base stations

John Gajadharsing talks in detail about the types and specifications of various Doherty amplifiers for cellular base stations.

Analysis
28th September 2010
Call for Entries: NXP mbed Design Challenge 2010

NXP Semiconductors N.V. has officially kicked off the NXP mbed Design Challenge 2010. Starting today, engineers from around the world are invited to use the mbed NXP LPC1768 prototyping board and mbed online Cloud compiler to develop an innovative hardware- or software-based application. Facts / Highlights:

Optoelectronics
28th September 2010
NXP Announces LDMOS UHF Transistor With DVB-T Output Power of 120W

NXP Semiconductors N.V. today announced the availability of an Ultra High Frequency (UHF) RF power transistor; the BLF888A, a 600W LDMOS device for broadcast transmitters and industrial applications. The BLF888A is the most powerful LDMOS broadcast transistor in the market to date. For a DVB-T signal over the full UHF band from 470 to 860MHz, the transistor can deliver 120W average power with efficiencies greater than 31 percent. Featuring excell...

Frequency
28th September 2010
NXP Announces LDMOS UHF Transistor With DVB-T Output Power of 120W

NXP Semiconductors N.V. today announced the availability of an Ultra High Frequency (UHF) RF power transistor; the BLF888A, a 600W LDMOS device for broadcast transmitters and industrial applications. The BLF888A is the most powerful LDMOS broadcast transistor in the market to date. For a DVB-T signal over the full UHF band from 470 to 860MHz, the transistor can deliver 120W average power with efficiencies greater than 31 percent. Featuring excell...

Analysis
22nd September 2010
NXP’s 150 MHz LPC1800 MCU Delivers Industry’s Highest ARM Cortex-M3 Performance

NXP today announced the availability of the industry‘s highest performance ARM Cortex-M3 microcontroller. The LPC1800 is optimized for low power operation at very low frequencies all the way through to 150MHz maximum performance from either Flash or RAM. This performance provides maximum connectivity and bandwidth options for a wide range of demanding applications. The flexible dual-bank 256-bit wide Flash memories can be used for concurrent w...

Communications
14th September 2010
Versatile TDA20142 tuner reduces system costs and delivers exceptional performance in multiple applications

NXP today announced the TDA20142 – the first satellite silicon tuner addressing the challenging requirements of both free-to-air (FTA) and operator satellite set-top box (STB) applications. The TDA20142 also reduces system cost through competitive pricing and reduced bill of materials (BoM). The satellite silicon tuner will be showcased at IBC 2010 in Amsterdam.

Analysis
6th September 2010
NXP's MIFARE Plus Chosen to Power the Ground Transportation Ticketing Systems in Sochi, Russia in Preparation for the 2014 Winter Olympics

NXP Semiconductors N.V. (Nasdaq: NXPI) today announced that its contactless microcontroller, MIFARE Plus™, has been chosen by the Russian city of Sochi – host of the 2014 Winter Olympics – to power the Automatic Fare Collection (AFC) system of its ground transportation network. This will be the first rollout of MIFARE Plus in Russia and the Commonwealth of Independent States. Working with partners including the solution provider and equipme...

Wireless Microsite
6th September 2010
NXP HDMI Companion Chip for Mobile Devices, Providing Level Shifting for DDC, CEC and HPD

NXP announced the availability of a new HDMI companion chip for mobile devices, which provides bidirectional level shifting between the 1.8/3.3V (range between 1.62 and 3.63V) at the host side and the 5V of the HDMI connector side for the DDC (Display Data Channel), CEC (Consumer Electronics Control) and the HPD (Hot Plug Detect). All these lines, along with the HDMI 5V supply line, also offer a high level of ESD protection according to IEC61000-...

Wireless
6th September 2010
NXP HDMI Companion Chip for Mobile Devices, Providing Level Shifting for DDC, CEC and HPD

NXP announced the availability of a new HDMI companion chip for mobile devices, which provides bidirectional level shifting between the 1.8/3.3V (range between 1.62 and 3.63V) at the host side and the 5V of the HDMI connector side for the DDC (Display Data Channel), CEC (Consumer Electronics Control) and the HPD (Hot Plug Detect). All these lines, along with the HDMI 5V supply line, also offer a high level of ESD protection according to IEC61000-...

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