NXP Semiconductors has announced the availability of its Secure Service Development Platform (SSDP), developed to facilitate the rapid introduction of applications that utilise its NFC and embedded Secure Element (eSE) module, the PN66T. The platform provides a turnkey approach for the loader service on the PN66T, enabling a faster time-to-market for secure mobile applications. Secure NFC applications can now be realised quickly and easily, reduc...

NXP Semiconductors and Freescale Semiconductor are to merge. The companies have entered into a definitive agreement under which NXP will merge with Freescale in a transaction which values the combined enterprise at just over $40bn. The merger creates a high performance mixed signal semiconductor industry leader, with combined revenue of greater than $10 billion.

  From Booth E30 in Hall 7 at Mobile World Congress in Barcelona next week, NXP will demonstrate Near Field Magnetic Induction (NFMI) technology in a truly wireless earbud including wireless audio streaming from ear to ear, using the NxH2280 NFMI based radio transceiver.

Exhibiting in Hall 7, booth E30 at Mobile World Congress next week, NXP Semiconductors will showcase and discuss future mobility concepts for the connected car. NXP will highlight how drivers will experience autonomous driving, entertainment and smart and secure car access in the world of tomorrow.

NXP Semiconductors has unveiled two MCU families, LPC18Sxx and LPC43Sxx, to help embedded developers secure application code and data messages in connected applications against threats such as theft and cloning. The MCUs add support for secure boot and messaging to the advanced control, high-speed connectivity, timing and flexible peripherals of the preceding series.

NXP Semiconductors has completed its acquisition of Quintic’s BLE and wearable businesses, enhancing its ultra-low power RF-connectivity solutions key to the IoT.

NXP Semiconductors has, in partnership with Sonova, announced the collaborative development of Venture, a high performance next-gen hearing instrument platform. Using the advanced platform, Sonova has introduced a family of hearing aids, Phonak Audéo V, which launched in October 2014, aiming to address the low penetration rate of the technology in developing countries.

NXP Semiconductors has announced the launch of a contact smart card interface, the TDA8037. Optimised for next-gen pay TV applications worldwide, the TDA8037 offers high levels of card protection, including short circuit detection and ESD protection. The ability of the TDA8037 to operate in a 3V supply domain suits it for situations where power efficiency and performance reliability are paramount.

NXP Semiconductors has launched the ICODE SLIX 2, an RFID chip designed specifically for use in public and university libraries, which offers a ‘new approach to inventory management of books and media’. With built-in features to make inventory scans for books and media faster and more accurate, the chip aims to improve shelf accuracy and overall customer experience.

The Lenovo VIBE X2 Pro smartphone, due to be released in April this year, will use the LPC54100 series of MCUs from NXP Semiconductors for always-on sensor processing applications. Lenovo selected this MCU for its processing power and power efficiency to maximise battery life while supporting today's popular and innovative always-on sensor-based features.

  Configurable ICs delivering multiple logic functions from the same device can save space, reduce logistics and qualification costs. By Michael Lyons, NXP Semiconductors.

A disposable temperature logging foil demonstrator for cold chain monitoring has been developed by NXP and Enfucell. According to the NXP, the loggers currently used for cold chain monitoring are inadequate. Chemical temperature loggers can only detect simple cold chain excursion and do not indicate when the event occurred, while reusable electronic loggers can only be deployed at pallet level. 

A complete hardware and software reference demonstrator for secure NFC enabled mPOS solutions has been released by NXP Semiconductors, Creditcall and ViewAt Technology. Pre-validated for international EMVCo and Payment Card Industry (PCI) standards, the device provides a universal solution for all payment technologies. 

An IC for secure card payments, developed by NXP Semiconductors, has been granted D-PAS certification by Discover Financial Services. The certification applies to implementation of EMV across Discover Network.

Do you know what year the first MOSFET structure was patented? Or do you know which is quicker… the time it takes a power MOSFET to switch or the time it takes light to travel?

The journey to a safer, cleaner and smarter automotive industry. By Luc van Dijk, IC Architect, Vehicle Networking product line, NXP Semiconductors.

V2X technology will allow cars to communicate with one another and the surrounding intelligent traffic infrastructure by wirelessly exchanging real-time warning messages and traffic information. Aiming to drive the rapid global uptake of V2X technology, NXP Semiconductors has announced a follow-on investment in Cohda Wireless, a software company specialising in automotive safety applications.

Audi has concluded an extensive field test of V2V communications technology developed by NXP Semiconductors and Cohda Wireless. During the test, V2V-enabled Audi vehicles equipped with the NXP RoadLINK chipset drove towards one another at relative speeds of up to 500km/h, communicating across distances of more than 2km. 

NXP has announced the findings of its commissioned IoT study, conducted by Harris Poll. Conducted online in early December 2014, the survey questioned 2,042 American adults and determined that 81% of Americans admit that their concern for privacy impacts their decision to invest in a smart home device, connected workspace gadget or connected car. 56% of all Americans said these concerns have impacted their decisions either ver...

A true one-chip solution for smart car access, which is claimed to be a world first, has been introduced by NXP Semiconductors. The NCF29A1 combines Passive Keyless Entry (PKE), an RF transmitter for remote control and an immobiliser in an HVQVN32 package. Key designs and form factors such as PKE chips in smartphones, smartwatches or smartphone cases, which support complementary car access via mobile devices, can be realised using this solution.&...