The 5th April saw young UK scientists compete at the Imperial College, London, in the UK Qualification round of The NXP Cup Challenge 2016. The Winning team and its two best contenders will compete at the European NXP Cup final in Munich, 9th-10th May.

NXP Semiconductors and the European truck manufacturer DAF will demonstrate platooning, a future traffic management technology, on public roads in Belgium and the Netherlands. The demonstration is part of the European Union International Truck Platooning Challenge, an event organised by the Dutch Ministry of Infrastructure and the Environment.

One million students in the UK are about to join the maker movement. NXP Semiconductors N.V. in partnership with the British Broadcasting Company (BBC) and a range of other organisations, have announced that they will officially set the iconic program into motion and begin rolling out micro:bit devices to seventh-grade students in the UK this week.

NXP Semiconductors has announced that NXP's i.MX 7 series applications processor enables OrCam’s revolutionary wearable personal assistant product. Introduced at CES 2016, OrCam-MyMe, an open development platform for wearables with artificial intelligence capabilities, continuously processes visual and audio signals to create an 'augmented attention' experience that enables context-based applications.

NXP Semiconductors has announced it has joined the U.S. Department of Transportation’s Smart City Challenge as a provider of vehicle-to-vehicle and vehicle-to-infrastructure (V2X) technology. With this partnership, NXP, together with its partner Cohda Wireless, will provide the contest’s winning community with wireless technology that allows cars to securely exchange data, such as hazard warnings, over distances of more than a mile to...

NXP Semiconductors has announced the launch of a contactless development platform specifically designed to champion new and emerging business models for the smart card market - MIFARE DESFire EV2.

A new family of logic translators, designed for low power, low voltage and high performance applications, has been introduced by NXP. The family of AXP translators offer a low power and voltage translator solution while also offering a wide range of voltage translation from 0.7V to 5.5V.

PN7462 is a unique family of single-chip solutions that combines a low power ARM Cortex-M0 MCU core with USB, a contact as well as a contactless interface with full NFC - all in one highly integrated chip. The NFC controller can be loaded with fully-custom applications, targeting access management, home banking or USB reader solutions.

Designed to be the 'perfect' enabler for NFC in home-automation and consumer applications, this feature-packed, next-gen connected NFC tag is the fastest, most BOM optimised way to add 'tap-and-connect' communications to any electronic device.

NXP Semiconductors has introduced the QorIQ LS1012A processor, delivering enterprise-class performance and security capabilities to consumer and networking applications, all in a package size normally associated with MCUs. Combining a 64-bit ARM v8-based processor with network packet acceleration and QorIQ trust architecture security capabilities, the device features line-rate networking performance at 1W typical power in a 9.6x9.6mm package.

NXP Semiconductors has introduced the MMZ25332B4 InGaP HBT linear amplifier. The device is housed in a 4x4mm QFN package that can be used on thicker PCB, particularly where thermal sensitivity is high. The MMZ25332B4 is a 2W, two-stage, wideband linear amplifier designed for small cell, W-CDMA and LTE base station applications. It operates at 1500 – 2700MHz from a supply voltage of 3-5V.

NXP Semiconductors this week hosts the Winter Workshop for the EcoCAR 3 Advanced Vehicle Technology Competition (AVTC) at NXP’s campus in Austin. EcoCAR 3 is a four-year collegiate engineering programme sponsored by the U.S. Department of Energy (DOE) and General Motors (GM) that gives students the chance to redesign, build and demonstrate cutting-edge, eco-friendly automotive technologies in the all-new 2016 Chevrolet Camaro.

NXP Semiconductors and Guala Closures Group has announced a collaboration to develop next gen closure solutions for the wine and spirits industry. These smart-security closure solutions will integrate NFC technology, providing anti-counterfeit and tamper-evident applications and monitoring.

NXP Semiconductors hosted the 'NXP Connects Silicon Valley' event at the Club Auto Sport, on the 12th of January. Secure, connected self-driving cars require a vast range of technologies and expertise from different industries. The event brings together leading connected car influencers as well as innovative startups to showcase the latest innovations for the connected car.

NXP Semiconductors has announced what it claims to be the industry’s most comprehensive smart home solutions, each integrating a vast array of technologies critical for the creation of end-products that make smart homes more secure, connected and convenient. The solutions include production-ready modules and reference designs for smart lighting, smoke detection, motion sensing and a variety of other popular smart home applications.

NXP Semiconductors has announced the next step in innovation for its market-leading automotive radar portfolio: the world's smallest single-chip 77GHz radar transceiver (7.5x7.5mm) with very high resolution performance. Radar is a core technology in existing and future ADAS, as it provides precise data about the surrounding driving environment, ultimately making life safer for drivers and commuters on the road.

NXP Semiconductors has introduced the world’s most power efficient Bluetooth Low Energy (BLE) SoC solution. The chip is 40% more energy efficient than its closest competitor and can deliver an unprecedented 2X longer battery life for wearable and fitness tracking devices. The QN 9080 can run multiple applications and features a fusion signal processor for continuous sensing in an 'always-on' state.

NXP Semiconductors has announced that its Near Field Magnetic Induction (NFMI) technology, along with its ARM Cortex-M4F based Kinetis microcontroller, enables a new generation of smart hearables. An example of this solution will be demonstrated in the NXP CES booth, CP25.

NXP’s Smarter World Tour is starting its journey in Europe today. The Smarter World Tour is a highly visible, 36 tons, 2 levels, fully mobile semi-truck trailer designed by Luigi Colani which turns into a large and spacious mobile tradeshow. The aim of the NXP Smarter World Tour in Europe is to allow the company to engage with its customers, partners, as well as universities and communities and let them discover and experience first-hand th...

With the PN5180, NXP Semiconductors, co-inventor of NFC, has announced the beginning of a new era in the evolution of NFC to bring intuitive proximity technology everywhere. PN5180 is an advanced, multi-protocol (ISO/IEC 15693, Felica, MIFARE and ISO/IEC 14443A/B) NFC frontend that delivers more efficient, robust and reliable operation, even in harsh environments.